Inventor · disambiguated record
Julian Partridge
Also filed as: PARTRIDGE JULIAN · PARTRIDGE JULIAN P · PARTRIDGE JULIAN PETER
27 granted patents·13 pending applications·831 citations·filing 1991–2010
97Inventor score
Files withENTORIAN TECHNOLOGIES LP13STAKTEK GROUP LP13IBM6CADY JAMES W2STAKTEK GROUP L P A TEXAS LTD2
Top patents by PatentIndex Score
40 records- 0198US7033861B1Stacked module systems and methodSTAKTEK GROUP LP·Filed 2005·Granted Apr 25, 2006·84 cites·22 claims
- 0297US5492266AFine pitch solder deposits on printed circuit board process and productIBM·Filed 1994·Granted Feb 20, 1996·195 cites·13 claims
- 0396US7026708B2Low profile chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2003·Granted Apr 11, 2006·79 cites·25 claims
- 0495US7094632B2Low profile chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Aug 22, 2006·51 cites·6 claims
- 0594US7180167B2Low profile stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Feb 20, 2007·61 cites·10 claims
- 0690US7417310B2Circuit module having force resistant constructionENTORIAN TECHNOLOGIES LP·Filed 2006·Granted Aug 26, 2008·23 cites·43 claims
- 0786US7579687B2Circuit module turbulence enhancement systems and methodsENTORIAN TECHNOLOGIES LP·Filed 2006·Granted Aug 25, 2009·18 cites·19 claims
- 0884US5493075AFine pitch solder formation on printed circuit board process and productIBM·Filed 1994·Granted Feb 20, 1996·55 cites·4 claims
- 0983US5286417AMethod and composition for making mechanical and electrical contactIBM·Filed 1991·Granted Feb 15, 1994·76 cites·13 claims
- 1080US8208259B1System, apparatus and method for cooling electronic componentsWOLFE MARK·Filed 2010·Granted Jun 26, 2012·9 cites·21 claims
- 1180US7760513B2Modified core for circuit module system and methodENTORIAN TECHNOLOGIES LP·Filed 2006·Granted Jul 20, 2010·8 cites·18 claims
- 1279US7804985B2Circuit module having force resistant constructionENTORIAN TECHNOLOGIES LP·Filed 2008·Granted Sep 28, 2010·8 cites·10 claims
- 1379US5535936AFine pitch solder formation on printed circuit board process and productIBM·Filed 1995·Granted Jul 16, 1996·45 cites·10 claims
- 1476US5825629APrint circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachmentIBM·Filed 1996·Granted Oct 20, 1998·37 cites·1 claims
- 1575US7656678B2Stacked module systemsENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Feb 2, 2010·6 cites·6 claims
- 1675US7375418B2Interposer stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2006·Granted May 20, 2008·6 cites·25 claims
- 1775US5141602AHigh-productivity method and apparatus for making customized interconnectionsIBM·Filed 1991·Granted Aug 25, 1992·55 cites·40 claims
- 1871US7323364B2Stacked module systems and methodSTAKTEK GROUP LP·Filed 2006·Granted Jan 29, 2008·3 cites·21 claims
- 1965US7572671B2Stacked module systems and methodsENTORIAN TECHNOLOGIES LP·Filed 2007·Granted Aug 11, 2009·1 cites·17 claims
- 2063US7304382B2Managed memory componentSTAKTEK GROUP LP·Filed 2006·Granted Dec 4, 2007·3 cites·32 claims
- 2162US7446403B2Carrier structure stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2006·Granted Nov 4, 2008·1 cites·20 claims
- 2260US7626273B2Low profile stacking system and methodENTORIAN TECHNOLOGIES L P·Filed 2009·Granted Dec 1, 2009·1 cites·7 claims
- 2360US7371609B2Stacked module systems and methodsSTAKTEK GROUP LP·Filed 2004·Granted May 13, 2008·5 cites·17 claims
- 2458US7508069B2Managed memory componentENTORIAN TECHNOLOGIES LP·Filed 2006·Granted Mar 24, 2009·1 cites·27 claims
- 2558US2009298230A1Stacked Module Systems and MethodsSTAKTEK GROUP LP·Filed 2009·Application pending·0 cites
- 2656US7675155B2Carrier structure stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2008·Granted Mar 9, 2010·0 cites·5 claims
- 2753US2009273069A1Low profile chip scale stacking system and methodCADY JAMES W·Filed 2009·Application pending·0 cites
- 2852US2007114649A1Low Profile Stacking System and MethodSTAKTEK GROUP L P A TEXAS LTD·Filed 2007·Application pending·0 cites
- 2952US2007117262A1Low Profile Stacking System and MethodSTAKTEK GROUP L P A TEXAS LTD·Filed 2007·Application pending·0 cites
- 3051US2005242423A1Stacked module systems and methodsSTAKTEK GROUP LP·Filed 2005·Application pending·0 cites
- 3147US2008211077A1Low profile chip scale stacking system and methodCADY JAMES W·Filed 2006·Application pending·0 cites
- 3246US7759791B2High density IC moduleENTORIAN TECHNOLOGIES LP·Filed 2007·Granted Jul 20, 2010·0 cites·2 claims
- 3346US7573129B2Contrast interposer stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2006·Granted Aug 11, 2009·0 cites·20 claims
- 3444US2009309214A1Circuit Module Turbulence EnhancementENTORIAN TECHNOLOGIES LP·Filed 2009·Application pending·0 cites
- 3544US2009294948A1Contrast Interposer Stacking System And MethodPARTRIDGE JULIAN·Filed 2009·Application pending·0 cites
- 3642US2003234443A1Low profile stacking system and methodSTAKTEK GROUP LP·Filed 2003·Application pending·0 cites
- 3741US2005009234A1Stacked module systems and methods for CSP packagesSTAKTEK GROUP LP·Filed 2004·Application pending·0 cites
- 3841US2004195666A1Stacked module systems and methodsFiled 2004·Application pending·0 cites
- 3941US2005056921A1Stacked module systems and methodsSTAKTEK GROUP LP·Filed 2004·Application pending·0 cites
- 4040US2004245615A1Point to point memory expansion system and methodSTAKTEK GROUP LP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →