Inventor · disambiguated record
Kazuaki Karasawa
Also filed as: KARASAWA KAZUAKI
18 granted patents·4 pending applications·517 citations·filing 1992–2021
95Inventor score
Files withFUJITSU LTD22
Top patents by PatentIndex Score
22 records- 0195US5611481AIntegrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 1995·Granted Mar 18, 1997·97 cites·12 claims
- 0295US5284796AProcess for flip chip connecting a semiconductor chipFUJITSU LTD·Filed 1992·Granted Feb 8, 1994·237 cites·6 claims
- 0385US6008071AMethod of forming solder bumps onto an integrated circuit deviceFUJITSU LTD·Filed 1996·Granted Dec 28, 1999·50 cites·18 claims
- 0481US9820412B2Modular data centerFUJITSU LTD·Filed 2015·Granted Nov 14, 2017·4 cites·6 claims
- 0581US7339277B2Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrateFUJITSU LTD·Filed 2005·Granted Mar 4, 2008·8 cites·7 claims
- 0679US6624501B2Capacitor and semiconductor deviceFUJITSU LTD·Filed 2001·Granted Sep 23, 2003·21 cites·34 claims
- 0772US11714057B2Method of manufacturing gas sensor deviceFUJITSU LTD·Filed 2021·Granted Aug 1, 2023·0 cites·2 claims
- 0872US6136047ASolder bump transfer plateFUJITSU LTD·Filed 1998·Granted Oct 24, 2000·26 cites·3 claims
- 0964US5877079AMethod for manufacturing a semiconductor device and a method for mounting a semiconductor device for eliminating a voidFUJITSU LTD·Filed 1997·Granted Mar 2, 1999·31 cites·8 claims
- 1063US11073492B2Sensor device, method for producing same, and gas sensorFUJITSU LTD·Filed 2018·Granted Jul 27, 2021·0 cites·20 claims
- 1162US6608381B1Integrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 2000·Granted Aug 19, 2003·6 cites·9 claims
- 1261US6873038B2Capacitor and semiconductor device and method for fabricating the semiconductor deviceFUJITSU LTD·Filed 2003·Granted Mar 29, 2005·7 cites·10 claims
- 1360US2018313776A1Gas sensor device, gas measuring device, and method of manufacturing gas sensor deviceFUJITSU LTD·Filed 2018·Application pending·0 cites
- 1455US10371658B2Gas sensor and sensor apparatusFUJITSU LTD·Filed 2017·Granted Aug 6, 2019·0 cites·9 claims
- 1553US10495595B2Gas sensor device, gas measurement method, and gas measurement deviceFUJITSU LTD·Filed 2016·Granted Dec 3, 2019·0 cites·15 claims
- 1649US10481146B2Gas sensor and information processing systemFUJITSU LTD·Filed 2016·Granted Nov 19, 2019·0 cites·5 claims
- 1748US6121062AProcess of fabricating semiconductor unit employing bumps to bond two componentsFUJITSU LTD·Filed 1996·Granted Sep 19, 2000·15 cites·41 claims
- 1848US5977637AIntegrated electronic device having flip-chip connection with circuit boardFUJITSU LTD·Filed 1996·Granted Nov 2, 1999·8 cites·14 claims
- 1946US6764938B2Integrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 1999·Granted Jul 20, 2004·7 cites·5 claims
- 2044US2004209453A1Integrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2144US2005062157A1Substrate with terminal pads having respective single solder bumps formed thereonFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2241US2017299536A1Gas analyzer and gas analysis methodFUJITSU LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →