Inventor · disambiguated record
Jong Kook Kim
Also filed as: KIM JONG K · KIM JONG-KOOK
23 granted patents·12 pending applications·210 citations·filing 1990–2023
95Inventor score
Top patents by PatentIndex Score
35 records- 0195US9349713B2Semiconductor package stack structure having interposer substrateKIM JONG-KOOK·Filed 2015·Granted May 24, 2016·62 cites·20 claims
- 0294US7271496B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2005·Granted Sep 18, 2007·29 cites·20 claims
- 0392US10391518B2Method for manufacturing transparent pattern print steel platePOSCO·Filed 2015·Granted Aug 27, 2019·7 cites·18 claims
- 0486US7453156B2Wire bond interconnectionCHIPPAC INC·Filed 2005·Granted Nov 18, 2008·11 cites·22 claims
- 0585US7909233B2Method of manufacturing a semiconductor package with fine pitch lead fingersSTATS CHIPPAC LTD·Filed 2010·Granted Mar 22, 2011·7 cites·10 claims
- 0684US7429798B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2007·Granted Sep 30, 2008·11 cites·20 claims
- 0782US2023357598A1Method of manufacturing a stainless steel sheet having etching patternsPOSCO CO LTD·Filed 2023·Application pending·0 cites
- 0879US7731078B2Semiconductor system with fine pitch lead fingersSTATS CHIPPAC LTD·Filed 2005·Granted Jun 8, 2010·7 cites·10 claims
- 0976US8129263B2Wire bond interconnection and method of manufacture thereofLEE HUN-TEAK·Filed 2011·Granted Mar 6, 2012·3 cites·16 claims
- 1074US7745322B2Wire bond interconnectionCHIPPAC INC·Filed 2008·Granted Jun 29, 2010·4 cites·8 claims
- 1172US11063346B2Shark fin antenna for vehicleINFAC ELECS CO LTD·Filed 2020·Granted Jul 13, 2021·2 cites·11 claims
- 1272US9129826B2Epoxy bump for overhang dieLEE HUN TEAK·Filed 2006·Granted Sep 8, 2015·6 cites·17 claims
- 1372US7986047B2Wire bond interconnectionCHIPPAC INC·Filed 2010·Granted Jul 26, 2011·2 cites·9 claims
- 1470US6040462ACalix[4 ]arene dibenzo crown ethers, their preparation process and their use for the selective extraction of cesium ionKOREA ATOMIC ENERGY RES·Filed 1998·Granted Mar 21, 2000·15 cites·4 claims
- 1567US7407080B2Wire bond capillary tipCHIPPAC INC·Filed 2004·Granted Aug 5, 2008·14 cites·18 claims
- 1666US7928435B2Interposer chip and multi-chip package having the interposer chipSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Apr 19, 2011·3 cites·22 claims
- 1765US5157450AApparatus for reversely turning copied sheets for a copying machineHYUNDAI ELECTRONICS INC CO LTD·Filed 1990·Granted Oct 20, 1992·17 cites·9 claims
- 1859US2020255687A1Coating composition having excellent corrosion resistance and fingerprint resistance, stainless steel sheet having etching patterns, and manufacturing method thereforPOSCO·Filed 2016·Application pending·0 cites
- 1957US7254757B2Flash memory test system and method capable of test time reductionSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 7, 2007·7 cites·19 claims
- 2051US7652382B2Micro chip-scale-package systemSTATS CHIPPAC LTD·Filed 2007·Granted Jan 26, 2010·0 cites·18 claims
- 2150US2013256916A1Semiconductor packages and methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2249US8256660B2Semiconductor package system with fine pitch lead fingers and method of manufacturing thereofLEE HUN TEAK·Filed 2011·Granted Sep 4, 2012·0 cites·21 claims
- 2349US2011289798A1Functional shoeJUNG HYUN-YOUNG·Filed 2011·Application pending·0 cites
- 2448US7298052B2Micro chip-scale-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Nov 20, 2007·0 cites·12 claims
- 2548US2017012025A1Semiconductor packages and methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2645US8519517B2Semiconductor system with fine pitch lead fingers and method of manufacturing thereofLEE HUN TEAK·Filed 2011·Granted Aug 27, 2013·0 cites·10 claims
- 2745US2015051728A1Detecting method of abnormality of machine tool operationKOREA TOOL MONITORING CO LTD·Filed 2013·Application pending·0 cites
- 2844US10056321B2Semiconductor package and method for routing the packageKWON HEUNG KYU·Filed 2013·Granted Aug 21, 2018·0 cites·23 claims
- 2944US2014312489A1Flip-chip semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3042US2005271830A1Chemical vapor deposition methodPARK YUN-SOO·Filed 2005·Application pending·0 cites
- 3140US2007001296A1Bump for overhang deviceSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
- 3236US2008225598A1Flash memory and method for checking status register by block unitSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3336US2007133988A1GPON system and method for bandwidth allocation in GPON systemKIM YU-GUN·Filed 2006·Application pending·0 cites
- 3436US2007133989A1GPON system and method for bandwidth allocation in GPON systemKIM YU-GUN·Filed 2006·Application pending·0 cites
- 3535US6637970B1Connector for prefabricated structuresTOIN ENVIRONMENTAL DESIGN CO L·Filed 2002·Granted Oct 28, 2003·3 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →