Semiconductor packages and methods of manufacturing semiconductor packages

Abstract

A semiconductor package including a mounting substrate, a first semiconductor chip mounted on an upper surface of the mounting substrate, a unit package stacked on the first semiconductor chip may be provided. The unit package includes a package substrate and a second semiconductor chip mounted on the package substrate. A plurality of bonding wires connects bonding pads of the mounting substrate and connection pads of the unit package, thereby electrically connecting the first and second semiconductor chips to each other. A molding member is provided on the mounting substrate to cover the first semiconductor chip and the unit package.

What is claimed is: 
     
         1 . A method of manufacturing a semiconductor package, comprising:
 mounting a first semiconductor chip on an upper surface of a mounting substrate to form a preliminary package;   testing the preliminary package;   stacking a unit package on the first semiconductor chip, the unit package including a package substrate and a second semiconductor chip mounted thereon;   connecting bonding pads of the mounting substrate and connection pads of the unit package using a plurality of bonding wires to electrically connect the first and second semiconductor chips to each other; and   forming a molding member on the mounting substrate to cover the first semiconductor chip and the unit package.   
     
     
         2 . The method of  claim 1 , wherein if the preliminary package passes the testing, the stacking a unit package on the first semiconductor chip is performed. 
     
     
         3 . The method of  claim 1 , wherein the stacking a unit package on the first semiconductor chip comprises:
 adhering a plurality of the preliminary packages on a carrier frame; and   stacking a plurality of the unit packages on the preliminary packages, respectively.   
     
     
         4 . The method of  claim 3 , wherein the molding member covers at least a side portion of the mounting substrate. 
     
     
         5 . The method of  claim 1 , wherein the bonding pads of the mounting substrate comprises data signal_bonding pads and control signal_bonding pads, and the data signal_bonding pads and the control signal_bonding pads are arranged along a side portion of the mounting substrate.