Inventor · disambiguated record
Chi Won Hwang
Also filed as: HWANG CHI-WON
25 granted patents·6 pending applications·91 citations·filing 2005–2024
94Inventor score
Files withSAMSUNG ELECTRO MECH16INTEL CORP7HWANG CHI-WON3IAC IN NAT UNIV CHUNGNAM2MUTHUKUMAR SRIRAM1
Top patents by PatentIndex Score
31 records- 0197US11178761B1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 16, 2021·5 cites·26 claims
- 0289US7268077B2Carbon nanotube reinforced metallic layerINTEL CORP·Filed 2005·Granted Sep 11, 2007·17 cites·13 claims
- 0384US7535099B2Sintered metallic thermal interface materials for microelectronic cooling assembliesINTEL CORP·Filed 2006·Granted May 19, 2009·12 cites·27 claims
- 0482US7882628B2Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-viasINTEL CORP·Filed 2007·Granted Feb 8, 2011·13 cites·15 claims
- 0582US7841080B2Multi-chip packaging using an interposer with through-viasINTEL CORP·Filed 2007·Granted Nov 30, 2010·10 cites·8 claims
- 0682US7514116B2Horizontal Carbon Nanotubes by Vertical Growth and RollingINTEL CORP·Filed 2005·Granted Apr 7, 2009·9 cites·14 claims
- 0780US8391016B2Carbon nanotube-reinforced solder caps, and chip packages and systems containing sameHWANG CHI-WON·Filed 2009·Granted Mar 5, 2013·11 cites·16 claims
- 0879US7600667B2Method of assembling carbon nanotube reinforced solder capsINTEL CORP·Filed 2006·Granted Oct 13, 2009·8 cites·14 claims
- 0975US10925161B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Granted Feb 16, 2021·2 cites·16 claims
- 1071US12309924B2Connection structure embedded substrate and substrate structure including the sameSAMSUNG ELECTRO MECH·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 1171US11997788B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted May 28, 2024·0 cites·34 claims
- 1271US2024276643A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1369US12211816B2Printed circuit board and electronic component package including the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 1466US7952203B2Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed therebyINTEL CORP·Filed 2008·Granted May 31, 2011·3 cites·14 claims
- 1566US2023245989A1Printed circuit board and electronic component package including the sameSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1663US12451418B2Printed circuit board and electronic component package including the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Oct 21, 2025·0 cites·19 claims
- 1761US11737211B2Connection structure embedded substrate and substrate structure including the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 22, 2023·0 cites·14 claims
- 1860US8387240B2Methods for making multi-chip packaging using an interposerMUTHUKUMAR SRIRAM·Filed 2010·Granted Mar 5, 2013·1 cites·20 claims
- 1959US12484148B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2022·Granted Nov 25, 2025·0 cites·11 claims
- 2058US12309923B2Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted May 20, 2025·0 cites·35 claims
- 2158US12004296B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 4, 2024·0 cites·15 claims
- 2257US12213251B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2022·Granted Jan 28, 2025·0 cites·18 claims
- 2355US12262470B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2022·Granted Mar 25, 2025·0 cites·23 claims
- 2451US2009072013A1Nano-scale particle paste for wiring microelectronic devices using ink-jet printingNATEKAR DEVENDRA·Filed 2008·Application pending·0 cites
- 2549US12439512B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2021·Granted Oct 7, 2025·0 cites·18 claims
- 2649US8975207B2Method for manufacturing adsorptive ball for recovering precious metals and flow through-continuous deionization (FT-CDI) apparatus using the sameIAC IN NAT UNIV CHUNGNAM·Filed 2012·Granted Mar 10, 2015·0 cites·3 claims
- 2747US2007227627A1Solder composition having dispersoid particles for increased creep resistanceSUH DAEWOONG·Filed 2006·Application pending·0 cites
- 2844US2009057378A1In-situ chip attachment using self-organizing solderHWANG CHI-WON·Filed 2007·Application pending·0 cites
- 2941US9096941B2Electrolytic cell for flow through-continuous deionizationIAC IN NAT UNIV CHUNGNAM·Filed 2012·Granted Aug 4, 2015·0 cites·3 claims
- 3041US2017004978A1Methods of forming high density metal wiring for fine line and space packaging applications and structures formed therebyHWANG CHI-WON·Filed 2007·Application pending·0 cites
- 3134US9832884B2Conductive ball mounting deviceSAMSUNG ELECTRO MECH·Filed 2015·Granted Nov 28, 2017·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →