Nano-scale particle paste for wiring microelectronic devices using ink-jet printing

Abstract

Nano-scale particle paste may be used for on-die routing and other applications using deposition and inkjet printing. A metal paste is applied to a surface of a die to electrically couple two spaced apart connection points of the die. Alternatively, or in addition, the paste may contain carbon nanotubes. The paste may be used on other surfaces as well.

1 . A method comprising applying a metal paste to a surface of a die to electrically couple two spaced apart connection points of the die. 
   
   
       2 . The method of  claim 1 , wherein applying comprises applying the paste through an ink jet. 
   
   
       3 . The method of  claim 2 , wherein applying comprises ink jet printing. 
   
   
       4 . The method of  claim 1 , wherein applying comprises applying the paste to an exterior surface of the die. 
   
   
       5 . The method of  claim 1 , wherein the connection points comprise a via and a die interconnect. 
   
   
       6 . The method of  claim 1 , wherein the connection points comprise a via and a pad. 
   
   
       7 . The method of  claim 1 , wherein the paste comprises a copper nano paste. 
   
   
       8 . The method of  claim 1 , further comprising curing the applied metal paste. 
   
   
       9 . The method of  claim 8 , further comprising applying a layer of additional metal paste over the cured metal paste. 
   
   
       10 . The method of  claim 1 , wherein the connection points comprise at least one interconnect to couple the die to another die of a stack. 
   
   
       11 . The method of  claim 1 , further comprising forming a pattern of carbon nanotubes and wherein applying comprises applying the paste over a pattern of carbon nanotubes. 
   
   
       12 . The method of  claim 1 , wherein applying comprises applying a series of dots to merge to form lines and then curing the series of dots. 
   
   
       13 . The method of  claim 1 , wherein applying comprises:
 applying a first line of paste;   partially curing the first line of paste;   applying a second line of paste over the partially cured first line of paste; and   then curing the first and second lines of paste together.   
   
   
       14 . The method of  claim 13 , wherein curing comprises sintering. 
   
   
       15 . The method of  claim 1 , wherein applying comprises applying the metal past to horizontal carbon nanotube structures to electrically couple the horizontal structures. 
   
   
       16 . The method of  claim 15 , wherein the horizontal structures comprise vertical structures that have been rolled to form horizontal structures. 
   
   
       17 . The method of  claim 1 , wherein applying the metal paste comprises printing the paste. 
   
   
       18 . The method of  claim 1 , wherein the metal paste comprises:
 a dispersant;   a stabilizer; and   carbon nanotubes.   
   
   
       19 . The method of  claim 18 , wherein the carbon nanotubes comprise black powder carbon nanotubes. 
   
   
       20 . The method of  claim 18 , wherein the paste further comprises metal nano-particles.