Inventor · disambiguated record
Chi-An Wang
Also filed as: WANG CHI · WANG CHI-AN
10 granted patents·8 pending applications·4 citations·filing 2004–2024
80Inventor score
Files withPOWERTECH TECHNOLOGY INC11TAIWAN SEMICONDUCTOR MFG CO LTD3WINBOND ELECTRONICS CORP2HUNG CHENG RIBBON ENTPR CO LTD1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
18 records- 0175US2025120139A1Semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0274US11024603B2Manufacturing method and a related stackable chip packagePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Jun 1, 2021·2 cites·6 claims
- 0373US10170458B2Manufacturing method of package-on-package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jan 1, 2019·1 cites·18 claims
- 0469US12089394B2Semiconductor structureWINBOND ELECTRONICS CORP·Filed 2022·Granted Sep 10, 2024·0 cites·9 claims
- 0569US10354978B1Stacked package including exterior conductive element and a manufacturing method of the samePOWERTECH TECHNOLOGY INC·Filed 2018·Granted Jul 16, 2019·1 cites·9 claims
- 0665US12176390B2Semiconductor device structure and method for forming the semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 0765US11495605B2Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·0 cites·9 claims
- 0862US2025380458A1Different Sacrificial Layers for Different Type DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0957US10276553B2Chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·0 cites·18 claims
- 1056US2018114781A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 1155US2018114782A1Manufacturing method of package-on-package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 1254US10424526B2Chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Sep 24, 2019·0 cites·16 claims
- 1354US10177060B2Chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jan 8, 2019·0 cites·19 claims
- 1454US2018114786A1Method of forming package-on-package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 1553US12467561B1Easy folding water pipe deviceHUNG CHENG RIBBON ENTPR CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·10 claims
- 1641US2005283498A1System and method to build, retrieve and track information in a knowledge database for trouble shooting purposesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1737US2019214367A1Stacked package and a manufacturing method of the samePOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 1836US2017358557A1Package-on-package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →