Package structure and manufacturing method thereof

Abstract

A package structure and a manufacturing method thereof are provided. The package structure includes a circuit carrier, a substrate, a die, a plurality of conductive wires and an encapsulant. The substrate is disposed on the circuit carrier and includes a plurality of openings. The die is disposed between the circuit carrier and the substrate. The conductive wires go through the openings of the substrate to electrically connect between the substrate and the circuit carrier. The encapsulant is disposed on the circuit carrier and encapsulates the die, the substrate and the conductive wires.

What is claimed is: 
     
         1 . A manufacturing method of a package structure, comprising:
 disposing a die on a circuit carrier;   disposing a substrate on the die, wherein the substrate comprises a plurality of openings;   forming a plurality of conductive wires going through the openings of the substrate to form electrical connection between the substrate and the circuit carrier; and   forming an encapsulant on the circuit carrier to encapsulate the die, the substrate and the conductive wires.   
     
     
         2 . The manufacturing method of a package structure according to  claim 1 , wherein the die is disposed on the circuit carrier through flip-chip bonding. 
     
     
         3 . The manufacturing method of a package structure according to  claim 1 , wherein disposing the substrate on the die is adhering disposing the substrate and the die to each other using an adhesive layer. 
     
     
         4 . The manufacturing method of a package structure according to  claim 1 , wherein forming a plurality of conductive wires is forming a plurality of conductive wires through a wire bonder. 
     
     
         5 . The manufacturing method of a package structure according to  claim 1 , wherein each of the conductive wires comprises a first segment connected to the circuit carrier, a second segment connected to the substrate and a central segment connected between the first segment and the second segment, the first segment is formed below the substrate, the second segment is formed above the substrate and the central segment is formed in one of the corresponding openings of the substrate. 
     
     
         6 . The manufacturing method of a package structure according to  claim 1 , further comprising:
 forming the openings on the substrate, wherein the openings surround the periphery of the die.   
     
     
         7 . The manufacturing method of a package structure according to  claim 1  further comprising:
 forming a plurality of vias on the encapsulant to expose at least a portion of the substrate. 
 
     
     
         8 . The manufacturing method of a package structure according to  claim 7 , wherein a depth of the vias is a distance between a surface of the substrate farthest from the circuit carrier and a surface of encapsulant farthest from the circuit carrier. 
     
     
         9 . The manufacturing method of a package structure according to  claim 7 , further comprising:
 filling the vias with a conductive element.   
     
     
         10 . The manufacturing method of a package structure according to  claim 9 , further comprising:
 disposing a semiconductor element on the encapsulant and electrically connecting the semiconductor element to the substrate through the vias.   
     
     
         11 . A package structure, comprising:
 a circuit carrier;   a substrate, disposed on the circuit carrier, wherein the substrate comprises a plurality of openings;   a die, disposed between the circuit carrier and the substrate;   a plurality of conductive wires, going through the openings of the substrate to electrically connect between the substrate and the circuit carrier; and   an encapsulant, disposed on the circuit carrier, wherein the encapsulant encapsulates the die, the substrate and the conductive wires.   
     
     
         12 . The package structure according to  claim 11 , further comprising:
 an adhesive layer, disposed between the circuit carrier and the substrate.   
     
     
         13 . The package structure according to  claim 11 , wherein the die comprises a plurality of conductive bumps facing toward the circuit carrier, and the die is electrically connected to the circuit carrier through the conductive bumps. 
     
     
         14 . The package structure according to  claim 11 , wherein a loop height of each of the conductive wires is greater than a distance between a surface of the substrate opposite to the circuit carrier and a surface of the circuit carrier facing toward the substrate. 
     
     
         15 . The package structure according to  claim 11 , wherein each of the conductive wires comprises a first segment connected to the circuit carrier, a second segment connected to the substrate and a central segment connected between the first segment and the second segment, the first segment is disposed below the substrate, the second segment is disposed above the substrate and the central segment is disposed in one of the corresponding openings of the substrate. 
     
     
         16 . The package structure according to  claim 11 , wherein the openings are arranged on the substrate surrounding the periphery of the die. 
     
     
         17 . The package structure according to  claim 11 , wherein the encapsulant comprises a plurality of vias exposing at least a portion of the substrate. 
     
     
         18 . The package structure according to  claim 17 , wherein a depth of the vias is a distance between a surface of the substrate farthest from the circuit carrier and a surface of the encapsulant farthest from the circuit carrier. 
     
     
         19 . The package structure according to  claim 17 , wherein the encapsulant comprises a conductive element disposed in the vias. 
     
     
         20 . The package structure according to  claim 19 , further comprising:
 a semiconductor element, disposed on the encapsulant, wherein the semiconductor element is electrically connected to the substrate through the vias.