Inventor · disambiguated record
Gundu M. Sabde
Also filed as: SABDE GUNDU · SABDE GUNDU M
36 granted patents·7 pending applications·952 citations·filing 1999–2013
98Inventor score
Top patents by PatentIndex Score
43 records- 0197US6383934B1Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquidsMICRON TECHNOLOGY INC·Filed 2000·Granted May 7, 2002·73 cites·98 claims
- 0296US6533893B2Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquidsMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 18, 2003·72 cites·30 claims
- 0396US6358122B1Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasivesMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 19, 2002·131 cites·8 claims
- 0495US6306012B1Methods and apparatuses for planarizing microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 23, 2001·124 cites·54 claims
- 0594US6331135B1Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasivesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 18, 2001·101 cites·25 claims
- 0693US6376381B1Planarizing solutions, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 23, 2002·138 cites·13 claims
- 0790US6461964B2Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 8, 2002·28 cites·8 claims
- 0889US7625495B2Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 1, 2009·8 cites·19 claims
- 0989US6468912B2Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 22, 2002·26 cites·9 claims
- 1088US6492273B1Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 10, 2002·51 cites·23 claims
- 1187US6472325B2Method and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 29, 2002·23 cites·11 claims
- 1286US6699791B2Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 2, 2004·19 cites·43 claims
- 1383US6419554B2Fixed abrasive chemical-mechanical planarization of titanium nitrideMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 16, 2002·41 cites·29 claims
- 1479US7121926B2Methods for planarization of group VIII metal-containing surfaces using a fixed abrasive articleMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 17, 2006·19 cites·34 claims
- 1579US6464824B1Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 15, 2002·49 cites·34 claims
- 1670US6881129B2Fixed-abrasive chemical-mechanical planarization of titanium nitrideMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 19, 2005·7 cites·24 claims
- 1769US6720266B2Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 13, 2004·6 cites·6 claims
- 1868US6997781B2Fixed-abrasive chemical-mechanical planarization of titanium nitrideMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 14, 2006·6 cites·22 claims
- 1966US7988529B2Methods and tools for controlling the removal of material from microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 2, 2011·2 cites·22 claims
- 2066US6858538B2Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 22, 2005·5 cites·2 claims
- 2159US7261832B2Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 28, 2007·3 cites·6 claims
- 2259US6485356B2Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasivesMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 26, 2002·4 cites·21 claims
- 2358US7566391B2Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic mediaMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 28, 2009·4 cites·56 claims
- 2458US2009255806A1Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic mediaMICRON TECHNOLOGY INC·Filed 2009·Application pending·0 cites
- 2557US8603319B2Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic mediaMICRON TECHNOLOGY INC·Filed 2012·Granted Dec 10, 2013·0 cites·20 claims
- 2657US6589101B2Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasivesMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 8, 2003·8 cites·44 claims
- 2753US8969217B2Methods of treating semiconductor substrates, methods of forming openings during semiconductor fabrication, and methods of removing particles from over semiconductor substratesMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 3, 2015·0 cites·16 claims
- 2853US8492288B2Methods of treating semiconductor substrates, methods of forming openings during semiconductor fabrication, and methods of removing particles from over semiconductor substratesFUCSKO JANOS·Filed 2008·Granted Jul 23, 2013·0 cites·25 claims
- 2953US6682628B2Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 27, 2004·4 cites·18 claims
- 3053US2006009136A1Fixed-abrasive chemical-mechanical planarization of titanium nitrideMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 3153US2006003675A1Fixed-abrasive chemical-mechanical planarization of titanium nitrideMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 3253US2005199588A1Fixed-abrasive chemical-mechanical planarization of titanium nitrideMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 3350US2006194518A1Methods for planarization of Group VIII metal-containing surfaces using a fixed abrasive articleMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 3450US2006261040A1Methods for planarization of group VIII metal-containing surfaces using oxidizing agentsMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 3549US7527545B2Methods and tools for controlling the removal of material from microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2006·Granted May 5, 2009·0 cites·32 claims
- 3644US7402094B2Fixed-abrasive chemical-mechanical planarization of titanium nitrideMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 22, 2008·0 cites·33 claims
- 3743US7138072B2Methods and apparatuses for planarizing microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 21, 2006·0 cites·2 claims
- 3842US7083700B2Methods and apparatuses for planarizing microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 1, 2006·0 cites·8 claims
- 3942US6903018B2Methods and apparatuses for planarizing microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 7, 2005·0 cites·8 claims
- 4042US6881127B2Method and apparatuses for planarizing microelectronic substrate assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 19, 2005·0 cites·4 claims
- 4141US6595833B2Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasivesMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 22, 2003·0 cites·44 claims
- 4237US2003119316A1Methods for planarization of group VIII metal-containing surfaces using oxidizing agentsMICRON TECHNOLOGY INC·Filed 2001·Application pending·0 cites
- 4333US6416401B1Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasivesMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 9, 2002·0 cites·47 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →