US2009255806A1PendingUtilityA1

Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media

Assignee: MICRON TECHNOLOGY INCPriority: Sep 1, 2004Filed: Jun 19, 2009Published: Oct 15, 2009
Est. expirySep 1, 2024(expired)· nominal 20-yr term from priority
H10P 52/402B23H 5/08C25F 3/02C25F 3/08C25F 1/00
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Claims

Abstract

Methods and systems for removing materials from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes providing a microfeature workpiece having a substrate material and a conductive material that includes a refractory metal (e.g., tantalum, tantalum nitride, titanium, and/or titanium nitride). First and second electrodes are positioned in electrical communication with the conductive material via a generally organic and/or non-aqueous electrolytic medium. At least one of the electrodes is spaced apart from the workpiece. At least a portion of the conductive material is removed by passing an electrical current along an electrical path that includes the first electrode, the electrolytic medium, and the second electrode. Electrolytically removing the conductive material can reduce the downforce applied to the workpiece.

Claims

exact text as granted — not AI-modified
1 . A system for removing material from a microfeature workpiece, comprising:
 a workpiece support configured to carry a microfeature workpiece with a process surface of the microfeature workpiece at a workpiece location;   first and second electrodes positioned proximate to the workpiece support, at least one of the first and record electrodes being spaced apart from the workpiece location; and   a polishing medium positioned at least proximate to the workpiece location, at least one of the polishing medium and the workpiece support being movable relative to the other, the polishing medium including a polishing pad material and an electrolytic medium, the electrolytic medium being generally organic, generally non-aqueous or both generally organic and generally non-aqueous, the electrolytic medium including:
 a solvent; and 
 an electrolyte. 
   
   
   
       2 . The system of  claim 1 , further comprising a corrosion inhibitor that at least inhibits corrosion of at least one of copper and a copper compound. 
   
   
       3 . The system of  claim 1 , further comprising an electrical current source coupled to the first and second electrodes, the electrical current source being configured to pass a varying electrical current through the first and second electrodes. 
   
   
       4 . The system of  claim 1  wherein the electrolytic medium includes methanol. 
   
   
       5 . The system of  claim 1  wherein the electrolytic medium includes an alcohol. 
   
   
       6 . The system of  claim 1  wherein the electrolytic medium is about 90% or more non-aqueous. 
   
   
       7 . The system of  claim 1  wherein the electrolytic medium includes a corrosion inhibitor. 
   
   
       8 . The system of  claim 1  wherein the electrolytic medium is approximately 99% or more organic. 
   
   
       9 . The system of  claim 1 , wherein the electrolytic medium includes at least one of NH 4 Cl, CuCl 2 , ammonium acetate, NH 4 -succinate, K-succinate and HF.

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