Inventor · disambiguated record
Toshikazu Endo
Also filed as: ENDO TOSHIKAZU
18 granted patents·15 pending applications·486 citations·filing 2000–2013
95Inventor score
Top patents by PatentIndex Score
33 records- 0198US6713162B2Electronic partsTDK CORP·Filed 2000·Granted Mar 30, 2004·151 cites·7 claims
- 0293US8523410B2Light source device with thermal dissipating membersHASHIMOTO NAOTAKA·Filed 2011·Granted Sep 3, 2013·32 cites·6 claims
- 0392US7060350B2Composite magnetic material and magnetic molding material, magnetic powder compression molding material, and magnetic paint using the composite magnetic material, composite dielectric material and molding material, powder compression molding material, paint, prepreg, and substrate using the composite dielectric material, and electronic partTDK CORP·Filed 2000·Granted Jun 13, 2006·75 cites·31 claims
- 0492US6808642B2Method for producing multilayer substrate and electronic part, and multilayer electronic partTDK CORP·Filed 2002·Granted Oct 26, 2004·62 cites·20 claims
- 0591US7081803B2Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and moduleTDK CORP·Filed 2004·Granted Jul 25, 2006·41 cites·6 claims
- 0690US6908960B2Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettinTDK CORP·Filed 2000·Granted Jun 21, 2005·58 cites·32 claims
- 0781US7733600B2Hard disk drive and wireless data terminal using the sameTDK CORP·Filed 2006·Granted Jun 8, 2010·10 cites·21 claims
- 0880US8742589B2Semiconductor embedded module and method for producing the sameKAWABATA KENICHI·Filed 2009·Granted Jun 3, 2014·9 cites·7 claims
- 0978US8414163B2Light source apparatusHASHIMOTO NAOTAKA·Filed 2011·Granted Apr 9, 2013·6 cites·11 claims
- 1074US6749928B2Electronic parts and method producing the sameTDK CORP·Filed 2002·Granted Jun 15, 2004·18 cites·10 claims
- 1167US7547975B2Module with embedded semiconductor IC and method of fabricating the moduleTDK CORP·Filed 2004·Granted Jun 16, 2009·14 cites·25 claims
- 1266US8572525B2Partition response surface modelingCHEW MARKO P·Filed 2010·Granted Oct 29, 2013·1 cites·28 claims
- 1360US8104009B1Wire mapping for programmable logic devicesKANG BYUNG-KYOO·Filed 2011·Granted Jan 24, 2012·2 cites·10 claims
- 1456US7890913B1Wire mapping for programmable logic devicesLATTICE SEMICONDUCTOR CORP·Filed 2008·Granted Feb 15, 2011·1 cites·15 claims
- 1556US7167071B2Inductive device and method for producing the sameTDK CORP·Filed 2004·Granted Jan 23, 2007·5 cites·15 claims
- 1654US7788623B1Composite wire indexing for programmable logic devicesLATTICE SEMICONDUCTOR CORP·Filed 2007·Granted Aug 31, 2010·1 cites·20 claims
- 1749US2005130447A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 1849US2005130446A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 1949US2005154110A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 2049US2008044660A1Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boardsTDK CORP·Filed 2007·Application pending·0 cites
- 2145US7812444B2Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded thereinTDK CORP·Filed 2006·Granted Oct 12, 2010·0 cites·20 claims
- 2244US2008079146A1Semiconductor-embedded substrate and manufacturing method thereofTDK CORP·Filed 2007·Application pending·0 cites
- 2343US2012243240A1Light source apparatusHASHIMOTO NAOTAKA·Filed 2011·Application pending·0 cites
- 2443US2014040848A1Controllable Turn-Around Time For Post Tape-Out FlowMENTOR GRAPHICS CORP·Filed 2013·Application pending·0 cites
- 2543US2012120670A1Light source apparatusHASHIMOTO NAOTAKA·Filed 2011·Application pending·0 cites
- 2643US2004202848A1Electronic parts and method producing the sameTDK CORP·Filed 2004·Application pending·0 cites
- 2743US2012187836A1Lamp and lighting apparatusHASHIMOTO NAOTAKA·Filed 2011·Application pending·0 cites
- 2840US2005003199A1Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boardsTDK CORP·Filed 2003·Application pending·0 cites
- 2938US2004265551A1Electronic component and process for manufacturing the sameTDK CORP·Filed 2004·Application pending·0 cites
- 3037US8286116B1Composite wire indexing for programmable logic devicesENDO TOSHIKAZU·Filed 2010·Granted Oct 9, 2012·0 cites·18 claims
- 3137US2003039101A1Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module componentTDK CORP·Filed 2002·Application pending·0 cites
- 3236US2003030994A1Substrate for electronic part and electronic partTDK CORP·Filed 2002·Application pending·0 cites
- 3336US2006180342A1Multilayer substrate and method for producing sameTAKAYA MINORU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →