Inventor · disambiguated record
Masahiro Komuro
Also filed as: KOMURO MASAHIRO
18 granted patents·8 pending applications·221 citations·filing 1997–2012
94Inventor score
Top patents by PatentIndex Score
26 records- 0190US8395269B2Method of stacking semiconductor chips including forming an interconnect member and a through electrodeKAWANO MASAYA·Filed 2010·Granted Mar 12, 2013·10 cites·25 claims
- 0286US7994048B2Method of manufacturing a through electrodeRENESAS ELECTRONICS CORP·Filed 2007·Granted Aug 9, 2011·13 cites·5 claims
- 0385US7914300B2Terminal mounting structure in electrical junction boxTOYOTA AUTO BODY CO LTD·Filed 2009·Granted Mar 29, 2011·20 cites·2 claims
- 0484US8089161B2Semiconductor device and method of manufacturing the sameKOMURO MASAHIRO·Filed 2009·Granted Jan 3, 2012·11 cites·10 claims
- 0583US6876064B2Semiconductor device having superior resistance to moistureNEC ELECTRONICS CORP·Filed 2004·Granted Apr 5, 2005·36 cites·14 claims
- 0680US5949145ASemiconductor device including alignment marksNEC CORP·Filed 1997·Granted Sep 7, 1999·56 cites·7 claims
- 0776US8102049B2Semiconductor device including through electrode and method of manufacturing the sameTAKAHASHI NOBUAKI·Filed 2007·Granted Jan 24, 2012·6 cites·14 claims
- 0869US8791567B2Semiconductor deviceTAKAHASHI NOBUAKI·Filed 2012·Granted Jul 29, 2014·2 cites·10 claims
- 0964US7833909B2Method of manufacturing semiconductor device, and etching apparatusNEC ELECTRONICS CORP·Filed 2009·Granted Nov 16, 2010·1 cites·5 claims
- 1064US7019400B2Semiconductor device having multilayer interconnection structure and method for manufacturing the deviceNEC ELECTRONICS CORP·Filed 2004·Granted Mar 28, 2006·12 cites·18 claims
- 1163US8217516B2Semiconductor device and method of manufacturing the sameTAKAHASHI NOBUAKI·Filed 2009·Granted Jul 10, 2012·2 cites·10 claims
- 1258US6326278B1Method of protecting an alignment mark when manufacturing a semiconductor deviceNEC CORP·Filed 1999·Granted Dec 4, 2001·23 cites·7 claims
- 1351US6316328B1Fabrication method for semiconductor device utilizing parallel alignment slitsNEC CORP·Filed 1999·Granted Nov 13, 2001·15 cites·7 claims
- 1451US2007126085A1Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 1548US6448147B2Semiconductor device and method for manufacturing the sameFiled 2001·Granted Sep 10, 2002·3 cites·12 claims
- 1647US2012100715A1Method of manufacturing a semiconductor device including through electrodeTAKAHASHI NOBUAKI·Filed 2011·Application pending·0 cites
- 1746US2011024041A1Method of manufacturing semiconductor device, and etching apparatusNEC ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 1845US2005218497A1Through electrode, spacer provided with the through electrode, and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2005·Application pending·0 cites
- 1944US2012083119A1Semiconductor device and method of manufacturing the sameKOMURO MASAHIRO·Filed 2011·Application pending·0 cites
- 2043US6261897B1Method of manufacturing a semiconductor deviceNEC CORP·Filed 1999·Granted Jul 17, 2001·7 cites·26 claims
- 2141US8426311B2Method and apparatus for manufacturing semiconductor deviceTAKAHASHI NOBUAKI·Filed 2010·Granted Apr 23, 2013·0 cites·20 claims
- 2239US2011215478A1Semiconductor element-embedded wiring substrateNEC CORP·Filed 2011·Application pending·0 cites
- 2338US6861759B2Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the sameNEC ELECTRONICS CORP·Filed 2003·Granted Mar 1, 2005·0 cites·8 claims
- 2437US2004155350A1Semiconductor device having multi-layer interconnection structureFiled 2004·Application pending·0 cites
- 2535US6288452B1Semiconductor device including registration accuracy marksNEC CORP·Filed 1999·Granted Sep 11, 2001·4 cites·5 claims
- 2634US2012153501A1Semiconductor device and manufacturing method thereofMURAI HIDEYA·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →