Inventor · disambiguated record
Periya Gopalan
Also filed as: GOPALAN PERIYA
19 granted patents·4 pending applications·344 citations·filing 1997–2023
95Inventor score
Files withAPPLIED MATERIALS INC10SPEEDFAM IPEC CORP9NOVELLUS SYSTEMS INC1SPEEDFAM CORP1UNIV JOHNS HOPKINS1
Top patents by PatentIndex Score
23 records- 0198US9421666B2Printed chemical mechanical polishing pad having abrasives thereinAPPLIED MATERIALS INC·Filed 2014·Granted Aug 23, 2016·49 cites·16 claims
- 0297US10016877B2Printed chemical mechanical polishing pad having abrasives therein and system for printingAPPLIED MATERIALS INC·Filed 2016·Granted Jul 10, 2018·14 cites·15 claims
- 0391US6685537B1Polishing pad window for a chemical mechanical polishing toolSPEEDFAM IPEC CORP·Filed 2000·Granted Feb 3, 2004·56 cites·28 claims
- 0489US6802955B2Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surfaceSPEEDFAM IPEC CORP·Filed 2002·Granted Oct 12, 2004·43 cites·31 claims
- 0586US12330260B2Polishing pad with secondary window sealAPPLIED MATERIALS INC·Filed 2023·Granted Jun 17, 2025·0 cites·10 claims
- 0686US6368183B1Wafer cleaning apparatus and associated wafer processing methodsSPEEDFAM IPEC CORP·Filed 2000·Granted Apr 9, 2002·39 cites·21 claims
- 0786US6213853B1Integral machine for polishing, cleaning, rinsing and drying workpiecesSPEEDFAM IPEC CORP·Filed 1997·Granted Apr 10, 2001·58 cites·68 claims
- 0881US6350177B1Combined CMP and wafer cleaning apparatus and associated methodsSPEEDFAM IPEC CORP·Filed 2000·Granted Feb 26, 2002·17 cites·13 claims
- 0976US11618124B2Polishing pad with secondary window sealAPPLIED MATERIALS INC·Filed 2020·Granted Apr 4, 2023·0 cites·15 claims
- 1073US6364745B1Mapping system for semiconductor wafer cassettesSPEEDFAM IPEC CORP·Filed 2000·Granted Apr 2, 2002·10 cites·12 claims
- 1169US7297239B2Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surfaceNOVELLUS SYSTEMS INC·Filed 2004·Granted Nov 20, 2007·11 cites·25 claims
- 1267US5954888APost-CMP wet-HF cleaning stationSPEEDFAM CORP·Filed 1998·Granted Sep 21, 1999·28 cites·15 claims
- 1366US10744618B2Polishing pad with secondary window sealAPPLIED MATERIALS INC·Filed 2017·Granted Aug 18, 2020·0 cites·20 claims
- 1461US11794308B2Printed chemical mechanical polishing pad having particles thereinAPPLIED MATERIALS INC·Filed 2018·Granted Oct 24, 2023·0 cites·11 claims
- 1560US9731397B2Polishing pad with secondary window sealAPPLIED MATERIALS INC·Filed 2015·Granted Aug 15, 2017·0 cites·20 claims
- 1657US8961266B2Polishing pad with secondary window sealAPPLIED MATERIALS INC·Filed 2013·Granted Feb 24, 2015·0 cites·23 claims
- 1755US2021402563A1Conditioner disk for use on soft or 3d printed pads during cmpAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1848US6818604B2System and method for cleaning workpiecesSPEEDFAM IPEC CORP·Filed 2001·Granted Nov 16, 2004·3 cites·31 claims
- 1947US6582587B1Cathodic protection design method, current mapping and systemUNIV JOHNS HOPKINS·Filed 1997·Granted Jun 24, 2003·7 cites·5 claims
- 2043US6125861APost-CMP wet-HF cleaning stationSPEEDFAM IPEC CORP·Filed 1998·Granted Oct 3, 2000·9 cites·13 claims
- 2136US2020306931A1Methods and apparatus for removing abrasive particlesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2234US2002077049A1Reinforced CMP carrier bladdersSPEEDFAM IPEC CORP·Filed 2000·Application pending·0 cites
- 2331US2002151255A1Chemical mechanical polishing method and apparatus for removing material from a surface of a workpiece that includes low-k materialFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →