Inventor · disambiguated record
Bo-Seong Kim
Also filed as: KIM BO SEONG
11 granted patents·9 pending applications·101 citations·filing 2005–2023
87Inventor score
Files withSAMSUNG ELECTRONICS CO LTD11LG DISPLAY CO LTD4AGENCY DEFENSE DEV1EDISON MOTORS CO LTD1HAN CHANG-HOON1
Top patents by PatentIndex Score
20 records- 0193US8664780B2Semiconductor package having plural semiconductor chips and method of forming the sameHAN CHANG-HOON·Filed 2012·Granted Mar 4, 2014·50 cites·19 claims
- 0288US7213329B2Method of forming a solder ball on a board and the boardSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 8, 2007·32 cites·23 claims
- 0387US8362624B2Multi-chip package and method of manufacturing thereofSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Jan 29, 2013·10 cites·20 claims
- 0483US11209698B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·14 claims
- 0580US10484347B2Method and apparatus for supporting secure chatSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 19, 2019·6 cites·5 claims
- 0669US11901348B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 0767US10483474B2Organic light-emitting device with electron blocking layer and trapping layer and organic light-emitting display using the sameLG DISPLAY CO LTD·Filed 2017·Granted Nov 19, 2019·1 cites·12 claims
- 0862US12307612B2Apparatus and method for creating intelligent special effects based on object recognitionUNIV SEJONG IND ACAD COOP FOUD·Filed 2023·Granted May 20, 2025·0 cites·8 claims
- 0961US11877463B2Light emitting display deviceLG DISPLAY CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·17 claims
- 1058US2020118993A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1154US2024215321A1Light emitting display deviceLG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 1251US2018122789A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1347US2022223752A1Method for manufacturing solar cell panel comprising prepreg by means of autoclaveEDISON MOTORS CO LTD·Filed 2020·Application pending·0 cites
- 1444US9246591B2Optical connector and stack module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 26, 2016·0 cites·10 claims
- 1542US2008164619A1Semiconductor chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1641US2025287806A1Light emitting display deviceLG DISPLAY CO LTD·Filed 2021·Application pending·0 cites
- 1741US2007001284A1Semiconductor package having lead free conductive bumps and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1839US2007138605A1Adhesive sheet, semiconductor device having the same, multi-stacked package having the same, and methods of manufacturing a semiconductor device and a multi-stacked packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1937US12235066B2Autonomous transport-based unmanned ammunition loading system for stationary guns and automatic loading device constituting sameAGENCY DEFENSE DEV·Filed 2022·Granted Feb 25, 2025·0 cites·13 claims
- 2032US2017048180A1Device and method for providing message serviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →