Inventor · disambiguated record
Everett D. Smith
Also filed as: SMITH EVERETT D
6 granted patents·679 citations·filing 1994–2000
89Inventor score
Top patents by PatentIndex Score
6 records- 0196US6143155AMethod for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assemblySPEEDFAM IPEC CORP·Filed 1998·Granted Nov 7, 2000·265 cites·26 claims
- 0294US6132586AMethod and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assemblyINTEGRATED PROCESS EQUIPMENT C·Filed 1998·Granted Oct 17, 2000·168 cites·26 claims
- 0389US6121152AMethod and apparatus for planarization of metallized semiconductor wafers using a bipolar electrode assemblyINTEGRATED PROCESS EQUIPMENT C·Filed 1998·Granted Sep 19, 2000·106 cites·26 claims
- 0483US5507732AQuick assembly catheter manifoldMEDTRONIC INC·Filed 1994·Granted Apr 16, 1996·86 cites·30 claims
- 0575US6184139B1Oscillating orbital polisher and methodSPEEDFAM IPEC CORP·Filed 1998·Granted Feb 6, 2001·33 cites·27 claims
- 0668US6500055B1Oscillating orbital polisher and methodSPEEDFAM IPEC CORP·Filed 2000·Granted Dec 31, 2002·21 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →