Assignee
INTEGRATED PROCESS EQUIPMENT C
US·16 granted patents·1,624 citations·filing 1990–1998
Top patents by PatentIndex Score
16 records- 0197US5643061APneumatic polishing head for CMP apparatusINTEGRATED PROCESS EQUIPMENT C·Filed 1995·Granted Jul 1, 1997·232 cites·20 claims
- 0295US5664990ASlurry recycling in CMP apparatusINTEGRATED PROCESS EQUIPMENT C·Filed 1996·Granted Sep 9, 1997·233 cites·28 claims
- 0394US6132586AMethod and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assemblyINTEGRATED PROCESS EQUIPMENT C·Filed 1998·Granted Oct 17, 2000·168 cites·26 claims
- 0493US5851140ASemiconductor wafer polishing apparatus with a flexible carrier plateINTEGRATED PROCESS EQUIPMENT C·Filed 1997·Granted Dec 22, 1998·241 cites·19 claims
- 0593US5755614ARinse water recycling in CMP apparatusINTEGRATED PROCESS EQUIPMENT C·Filed 1997·Granted May 26, 1998·143 cites·3 claims
- 0690US5563709AApparatus for measuring, thinning and flattening silicon structuresINTEGRATED PROCESS EQUIPMENT C·Filed 1994·Granted Oct 8, 1996·70 cites·12 claims
- 0790US5555474AAutomatic rejection of diffraction effects in thin film metrologyINTEGRATED PROCESS EQUIPMENT C·Filed 1994·Granted Sep 10, 1996·68 cites·21 claims
- 0889US6121152AMethod and apparatus for planarization of metallized semiconductor wafers using a bipolar electrode assemblyINTEGRATED PROCESS EQUIPMENT C·Filed 1998·Granted Sep 19, 2000·106 cites·26 claims
- 0989US5543919AApparatus and method for performing high spatial resolution thin film layer thickness metrologyINTEGRATED PROCESS EQUIPMENT C·Filed 1994·Granted Aug 6, 1996·71 cites·20 claims
- 1085US5885147AApparatus for conditioning polishing padsINTEGRATED PROCESS EQUIPMENT C·Filed 1997·Granted Mar 23, 1999·72 cites·23 claims
- 1180US5855792ARinse water recycling method for semiconductor wafer processing equipmentINTEGRATED PROCESS EQUIPMENT C·Filed 1997·Granted Jan 5, 1999·56 cites·20 claims
- 1271US5555472AMethod and apparatus for measuring film thickness in multilayer thin film stack by comparison to a reference library of theoretical signaturesINTEGRATED PROCESS EQUIPMENT C·Filed 1993·Granted Sep 10, 1996·37 cites·15 claims
- 1363US5227001AIntegrated dry-wet semiconductor layer removal apparatus and methodINTEGRATED PROCESS EQUIPMENT C·Filed 1990·Granted Jul 13, 1993·48 cites·19 claims
- 1458US5870793ABrush for scrubbing semiconductor wafersINTEGRATED PROCESS EQUIPMENT C·Filed 1997·Granted Feb 16, 1999·30 cites·19 claims
- 1556US5610102AMethod for co-registering semiconductor wafers undergoing work in one or more blind process modulesINTEGRATED PROCESS EQUIPMENT C·Filed 1993·Granted Mar 11, 1997·30 cites·18 claims
- 1649US5567255ASolid annular gas discharge electrodeINTEGRATED PROCESS EQUIPMENT C·Filed 1994·Granted Oct 22, 1996·19 cites·13 claims
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