Inventor · disambiguated record
Markus Nopper
Also filed as: NOPPER MARKUS
16 granted patents·7 pending applications·93 citations·filing 2002–2010
91Inventor score
Files withADVANCED MICRO DEVICES INC10NOPPER MARKUS3GLOBALFOUNDRIES INC2SEIDEL ROBERT2BONKASS MATTHIAS1
Top patents by PatentIndex Score
23 records- 0180US6951816B2Method of forming a metal layer over patterned dielectric by electroless deposition using a catalystADVANCED MICRO DEVICES INC·Filed 2003·Granted Oct 4, 2005·25 cites·28 claims
- 0278US8883610B2Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal linesSEIDEL ROBERT·Filed 2009·Granted Nov 11, 2014·8 cites·11 claims
- 0378US6620726B1Method of forming metal lines having improved uniformity on a substrateADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 16, 2003·21 cites·57 claims
- 0475US8314494B2Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devicesNOPPER MARKUS·Filed 2009·Granted Nov 20, 2012·9 cites·19 claims
- 0575US7899570B2Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedbackADVANCED MICRO DEVICES INC·Filed 2008·Granted Mar 1, 2011·6 cites·18 claims
- 0673US7781343B2Semiconductor substrate having a protection layer at the substrate back sideGLOBALFOUNDRIES INC·Filed 2007·Granted Aug 24, 2010·6 cites·20 claims
- 0766US7517782B2Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phaseADVANCED MICRO DEVICES INC·Filed 2006·Granted Apr 14, 2009·2 cites·26 claims
- 0865US7947158B2Apparatus and method for removing bubbles from a process liquidGLOBALFOUNDRIES INC·Filed 2009·Granted May 24, 2011·2 cites·15 claims
- 0961US6958247B2Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP processADVANCED MICRO DEVICES INC·Filed 2003·Granted Oct 25, 2005·10 cites·18 claims
- 1059US7560381B2Technique for metal deposition by electroless plating using an activation scheme including a substrate heating processADVANCED MICRO DEVICES INC·Filed 2005·Granted Jul 14, 2009·1 cites·15 claims
- 1151US7169664B2Method of reducing wafer contamination by removing under-metal layers at the wafer edgeADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 30, 2007·3 cites·17 claims
- 1249US7781329B2Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devicesADVANCED MICRO DEVICES INC·Filed 2009·Granted Aug 24, 2010·0 cites·24 claims
- 1346US7615103B2Apparatus and method for removing bubbles from a process liquidADVANCED MICRO DEVICES INC·Filed 2005·Granted Nov 10, 2009·0 cites·21 claims
- 1444US7476552B2Method of reworking a semiconductor structureADVANCED MICRO DEVICES INC·Filed 2005·Granted Jan 13, 2009·0 cites·18 claims
- 1542US2005067288A1Storage tank for process liquids with a reduced amount of bubblesFiled 2004·Application pending·0 cites
- 1641US2005241947A1System and method for an increased bath lifetime in a single-use plating regimeNOPPER MARKUS·Filed 2005·Application pending·0 cites
- 1741US2007077761A1Technique for forming a copper-based metallization layer including a conductive capping layerLEHR MATTHIAS·Filed 2006·Application pending·0 cites
- 1840US2003221966A1Method of electroplating copper over a patterned dielectric layerFiled 2002·Application pending·0 cites
- 1939US8389401B2Contact elements of semiconductor devices formed on the basis of a partially applied activation layerSEIDEL ROBERT·Filed 2010·Granted Mar 5, 2013·0 cites·17 claims
- 2038US2004188260A1Method of plating a semiconductor structureFiled 2003·Application pending·0 cites
- 2137US2006193992A1Method and system for controlling a substrate position in an electrochemical processBONKASS MATTHIAS·Filed 2005·Application pending·0 cites
- 2237US2007178690A1Semiconductor device comprising a metallization layer stack with a porous low-k material having an enhanced integrityNOPPER MARKUS·Filed 2006·Application pending·0 cites
- 2335US8323471B2Automatic deposition profile targetingORTLEB THOMAS·Filed 2008·Granted Dec 4, 2012·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →