Inventor · disambiguated record
Steve Oliver
Also filed as: OLIVER STEVE
21 granted patents·4 pending applications·95 citations·filing 2006–2023
93Inventor score
Files withMICRON TECHNOLOGY INC13APTINA IMAGING CORP3AKRAM SALMAN1BORTHAKUR SWARNAL1DUPARRE JACQUES1
Top patents by PatentIndex Score
25 records- 0194US8395242B2Semiconductor device having backside redistribution layersOLIVER STEVE·Filed 2011·Granted Mar 12, 2013·30 cites·17 claims
- 0292US7626269B2Semiconductor constructions and assemblies, and electronic systemsMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 1, 2009·20 cites·5 claims
- 0385US7892972B2Methods for fabricating and filling conductive vias and conductive vias so formedMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 22, 2011·10 cites·30 claims
- 0485US7710667B2Imaging module with symmetrical lens system and method of manufactureAPTINA IMAGING CORP·Filed 2008·Granted May 4, 2010·12 cites·15 claims
- 0582US8963292B2Semiconductor device having backside redistribution layers and method for fabricating the sameMICRON TECHNOLOGY INC·Filed 2013·Granted Feb 24, 2015·4 cites·19 claims
- 0678US8048708B2Method and apparatus providing an imager module with a permanent carrierMICRON TECHNOLOGY INC·Filed 2008·Granted Nov 1, 2011·5 cites·27 claims
- 0776US7932179B2Method for fabricating semiconductor device having backside redistribution layersMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 26, 2011·5 cites·18 claims
- 0871US8680634B2Method and apparatus providing an imager module with a permanent carrierBORTHAKUR SWARNAL·Filed 2011·Granted Mar 25, 2014·2 cites·39 claims
- 0970US8017982B2Imagers with contact plugs extending through the substrates thereof and imager fabrication methodsMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 13, 2011·3 cites·26 claims
- 1066US8679933B2Semiconductor device fabrication methodsKIRBY KYLE K·Filed 2011·Granted Mar 25, 2014·1 cites·24 claims
- 1164US8531046B2Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backsidePRATT DAVE·Filed 2011·Granted Sep 10, 2013·1 cites·18 claims
- 1260US7920342B2Over-molded glass lenses and method of forming the sameAPTINA IMAGING CORP·Filed 2008·Granted Apr 5, 2011·2 cites·11 claims
- 1357US9484378B2Semiconductor devices including back-side integrated circuitryMICRON TECHNOLOGY INC·Filed 2014·Granted Nov 1, 2016·0 cites·20 claims
- 1456US9966406B2Semiconductor devices including back-side integrated circuitryMICRON TECHNOLOGY INC·Filed 2016·Granted May 8, 2018·0 cites·20 claims
- 1554US11712844B2Lightweight structures having increased structural integrity and an ultra-low coefficient of thermal expansionEAGLE TECH LLC·Filed 2020·Granted Aug 1, 2023·0 cites·10 claims
- 1653US2013330922A1Semiconductor Constructions and Assemblies and Electronic SystemsMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 1752US2010123260A1Stamp with mask pattern for discrete lens replicationDUPARRE JACQUES·Filed 2008·Application pending·0 cites
- 1852US2008290435A1Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methodsMICRON TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 1951US8982469B2Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the sameHEMBREE DAVID R·Filed 2011·Granted Mar 17, 2015·0 cites·5 claims
- 2051US8294273B2Methods for fabricating and filling conductive vias and conductive vias so formedAKRAM SALMAN·Filed 2011·Granted Oct 23, 2012·0 cites·27 claims
- 2151US7955946B2Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 7, 2011·0 cites·42 claims
- 2251US7919230B2Thermal embossing of resist reflowed lenses to make aspheric lens master waferAPTINA IMAGING CORP·Filed 2008·Granted Apr 5, 2011·0 cites·25 claims
- 2351US7916396B2Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the sameMICRON TECHNOLOGY INC·Filed 2008·Granted Mar 29, 2011·0 cites·16 claims
- 2447US2008309900A1Method of making patterning device, patterning device for making patterned structure, and method of making patterned structureMICRON TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 2543USD1097073SWall plateSLOAN VALVE CO·Filed 2023·Granted Oct 7, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →