Assignee
AKRAM SALMAN
US·14 granted patents·28 pending applications·49 citations·filing 2004–2012
Top patents by PatentIndex Score
42 records- 0192US7282794B2Multiple die stack apparatus employing t-shaped interposer elementsAKRAM SALMAN·Filed 2005·Granted Oct 16, 2007·15 cites·4 claims
- 0291US8816405B2Elevated pocket pixels, imaging devices and systems including the same and method of forming the sameAKRAM SALMAN·Filed 2011·Granted Aug 26, 2014·4 cites·34 claims
- 0387US8324100B2Methods of forming conductive viasAKRAM SALMAN·Filed 2011·Granted Dec 4, 2012·7 cites·26 claims
- 0485US8502353B2Through-wafer interconnects for photoimager and memory wafersAKRAM SALMAN·Filed 2011·Granted Aug 6, 2013·5 cites·11 claims
- 0581US8111515B2Methods and apparatuses for transferring heat from stacked microfeature devicesAKRAM SALMAN·Filed 2009·Granted Feb 7, 2012·7 cites·16 claims
- 0679US8816463B2Wafer-level packaged microelectronic imagers having interconnects formed through terminalsAKRAM SALMAN·Filed 2012·Granted Aug 26, 2014·3 cites·18 claims
- 0778US8324101B2Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrateAKRAM SALMAN·Filed 2011·Granted Dec 4, 2012·3 cites·20 claims
- 0875US8129764B2Imager devices having differing gate stack sidewall spacers, method for forming such imager devices, and systems including such imager devicesAKRAM SALMAN·Filed 2008·Granted Mar 6, 2012·3 cites·8 claims
- 0973US8759970B2Semiconductor device having copper interconnect for bondingAKRAM SALMAN·Filed 2009·Granted Jun 24, 2014·2 cites·10 claims
- 1057US8647982B2Methods of forming interconnects in a semiconductor structureAKRAM SALMAN·Filed 2009·Granted Feb 11, 2014·0 cites·22 claims
- 1156US8389920B2Method and apparatus for breaking surface tension during a recessed color filter array processAKRAM SALMAN·Filed 2008·Granted Mar 5, 2013·0 cites·24 claims
- 1255US8637962B2Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrateAKRAM SALMAN·Filed 2012·Granted Jan 28, 2014·0 cites·16 claims
- 1355US2007170942A1Methods for fabricating fences on interposer substratesAKRAM SALMAN·Filed 2007·Application pending·0 cites
- 1454US2007117277A1Methods for fabricating protective layers on semiconductor device componentsAKRAM SALMAN·Filed 2007·Application pending·0 cites
- 1553US9960148B2Methods for transferring heat from stacked microfeature devicesAKRAM SALMAN·Filed 2012·Granted May 1, 2018·0 cites·11 claims
- 1652US2007262463A1Semiconductor substrate-based interconnection assembly for semiconductor device bearing external elementsAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 1752US2007066042A1Method of forming an electrical contactAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 1852US2007059915A1Method of forming an electrical contactAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 1952US2007069372A1Packaged die on PCB with heat sink encapsulant and methodsAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 2052US2007004200A1Selective activation of aluminum, copper, and tungsten structuresAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 2152US2006138660A1Copper interconnectAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 2252US2006189005A1Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substratesAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 2351US8294273B2Methods for fabricating and filling conductive vias and conductive vias so formedAKRAM SALMAN·Filed 2011·Granted Oct 23, 2012·0 cites·27 claims
- 2451US2006237839A1Apparatus for conducting heat in a flip-chip assemblyAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 2551US2005282313A1Methods for modifying semiconductor devices to stabilize the same and semiconductor device assemblyAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 2651US2007037418A1Process of forming socket contactsAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 2751US2005218483A1Method and semiconductor device having copper interconnect for bondingAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 2850US2006097381A1Chip package with grease heat sinkAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 2950US2005275750A1Wafer-level packaged microelectronic imagers and processes for wafer-level packagingAKRAM SALMAN·Filed 2004·Application pending·0 cites
- 3050US2007148807A1Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagersAKRAM SALMAN·Filed 2007·Application pending·0 cites
- 3150US2006027632A1Method for forming metal contacts on a substrateAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 3250US2005270045A1Electrical contactAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 3350US2007020868A1Semiconductor processing method and field effect transistorAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 3449US2006279943A1Interposers with alignment fences and semiconductor device assemblies including the interposersAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 3549US2005266610A1Manufacturing methods for semiconductor structures having stacked semiconductor devicesAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 3649US2005221533A1Method of making chip package with grease heat sinkAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 3748US2005247567A1Method of platingAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 3847US2006170110A1Through-substrate interconnect structures and assembliesAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 3944US2006220665A1Alignment fences and devices and assemblies including the sameAKRAM SALMAN·Filed 2006·Application pending·0 cites
- 4043US2006017451A1Substrates including alignment fencesAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 4142US2005269714A1Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substratesAKRAM SALMAN·Filed 2005·Application pending·0 cites
- 4242US2005208704A1Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereofAKRAM SALMAN·Filed 2005·Application pending·0 cites
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