Inventor · disambiguated record
Kwang Seop Youm
Also filed as: YOUM KWANG SEOP
4 granted patents·7 pending applications·8 citations·filing 2007–2016
64Inventor score
Files withSAMSUNG ELECTRO MECH7C O SAMSUNG ELECTRO MECHANICS CO LTD1HONG SUK CHANG1KIM KI-GON1LEE EUNG SUEK1
Top patents by PatentIndex Score
11 records- 0178US9392698B2Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCBSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 12, 2016·6 cites·9 claims
- 0268US10342135B2Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 2, 2019·2 cites·7 claims
- 0347US2014028336A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0447US2015003020A1Electronic component-embedded printed circuit board having cooling memberC O SAMSUNG ELECTRO MECHANICS CO LTD·Filed 2014·Application pending·0 cites
- 0544US2010288535A1Electronic component-embedded printed circuit board comprising cooling member and method of manufacturing the sameHONG SUK CHANG·Filed 2009·Application pending·0 cites
- 0643US2014300001A1Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0738US9318356B2Substrate stripSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 19, 2016·0 cites·10 claims
- 0836US2007241438A1Strip format of package board and array of the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 0935US2011266671A1Substrate for a semiconductor package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1030US8253032B2Printed circuit board strip and panelKIM KI-GON·Filed 2010·Granted Aug 28, 2012·0 cites·4 claims
- 1128US2012103671A1Printed circuit board and method for manufacturing the sameLEE EUNG SUEK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →