Inventor · disambiguated record
Yoshirou Kuromitsu
Also filed as: KUROMITSU YOSHIROU
37 granted patents·9 pending applications·389 citations·filing 1990–2018
97Inventor score
Files withMITSUBISHI MATERIALS CORP31KUROMITSU YOSHIROU4MITSUBISHI METAL CORP3HAYASHI HIROMASA1KITAHARA TAKESHI1
Top patents by PatentIndex Score
46 records- 0192US9066433B2Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrateKUROMITSU YOSHIROU·Filed 2012·Granted Jun 23, 2015·6 cites·16 claims
- 0289US6033787ACeramic circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 1997·Granted Mar 7, 2000·120 cites·10 claims
- 0386US9480144B2Power module substrate, power module substrate with heat sink, and power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Granted Oct 25, 2016·8 cites·8 claims
- 0485US9723707B2Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Aug 1, 2017·7 cites·12 claims
- 0581US9807865B2Substrate for power modules, substrate with heat sink for power modules, and power moduleMITSUBISHI MATERIALS CORP·Filed 2014·Granted Oct 31, 2017·5 cites·12 claims
- 0680US8198540B2Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power moduleKUROMITSU YOSHIROU·Filed 2007·Granted Jun 12, 2012·10 cites·15 claims
- 0778US5213877ACeramic substrate used for fabricating electric or electronic circuitMITSUBISHI MATERIALS CORP·Filed 1991·Granted May 25, 1993·61 cites·9 claims
- 0877US9504144B2Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding pasteMITSUBISHI MATERIALS CORP·Filed 2013·Granted Nov 22, 2016·4 cites·8 claims
- 0977US8564118B2Power module substrate, power module, and method for manufacturing power module substrateKUROMITSU YOSHIROU·Filed 2009·Granted Oct 22, 2013·5 cites·9 claims
- 1075US8609993B2Power module substrate, power module, and method for manufacturing power module substrateKUROMITSU YOSHIROU·Filed 2009·Granted Dec 17, 2013·5 cites·3 claims
- 1173US9414512B2Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power moduleNAGATOMO YOSHIYUKI·Filed 2010·Granted Aug 9, 2016·5 cites·4 claims
- 1273US8921996B2Power module substrate, power module, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Dec 30, 2014·2 cites·20 claims
- 1369US9079264B2Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 14, 2015·2 cites·10 claims
- 1469US7138350B2MgO vapor deposition material and method for preparation thereofMITSUBISHI MATERIALS CORP·Filed 2002·Granted Nov 21, 2006·9 cites·26 claims
- 1569US6995104B2Polycrystalline MgO deposition material having adjusted Si concentrationMITSUBISHI MATERIALS CORP·Filed 2003·Granted Feb 7, 2006·9 cites·3 claims
- 1669US6821616B1Protective thin film for FPDS, method for producing said thin film and FPDS using said thin filmMITSUBISHI MATERIALS CORP·Filed 1999·Granted Nov 23, 2004·26 cites·5 claims
- 1767US9968012B2Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted May 8, 2018·2 cites·8 claims
- 1867US9237682B2Power module substrate with heat sink, and method for producing power module substrate with heat sinkMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jan 12, 2016·2 cites·4 claims
- 1966US9426915B2Power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Granted Aug 23, 2016·2 cites·2 claims
- 2066US8044500B2Power module substrate, method for manufacturing power module substrate, and power moduleMITSUBISHI MATERIALS CORP·Filed 2007·Granted Oct 25, 2011·3 cites·4 claims
- 2166US5130498ACeramic substrate used for fabricating electric or electronic circuitMITSUBISHI METAL CORP·Filed 1990·Granted Jul 14, 1992·39 cites·14 claims
- 2265US9642275B2Power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Granted May 2, 2017·2 cites·2 claims
- 2363US8116084B2Method for manufacturing power module substrate, power module substrate, and power moduleKITAHARA TAKESHI·Filed 2008·Granted Feb 14, 2012·3 cites·4 claims
- 2461US9076755B2Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power moduleTONOMURA HIROSHI·Filed 2010·Granted Jul 7, 2015·2 cites·6 claims
- 2559US6965125B2Protective film for FPD, vapor deposition material for protective film and its production method, FPD, and manufacturing device for FPD protective filmMITSUSBISHI MATERIALS CORP·Filed 2003·Granted Nov 15, 2005·5 cites·15 claims
- 2659US6828588B2Protective film for FPD, vapor deposition material for protective film and its production method, FPD, and manufacturing device for FPD protective filmMITSUBISHI MATERIALS CORP·Filed 2001·Granted Dec 7, 2004·6 cites·13 claims
- 2756US9101063B2Power module substrate, power module, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Aug 4, 2015·0 cites·3 claims
- 2856US9095062B2Power module substrate, power module, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 28, 2015·0 cites·2 claims
- 2956US8637777B2Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrateHAYASHI HIROMASA·Filed 2009·Granted Jan 28, 2014·1 cites·12 claims
- 3055US2015022977A1Power module substrate, power module, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Application pending·0 cites
- 3151US2010258233A1Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2008·Application pending·0 cites
- 3250US6872115B2Blade with comb teeth coated with a compound layer for forming ribs and its production methodMITSUBISHI MATERIALS CORP·Filed 2002·Granted Mar 29, 2005·2 cites·24 claims
- 3349US11404622B2Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrateMITSUBISHI MATERIALS CORP·Filed 2018·Granted Aug 2, 2022·0 cites·6 claims
- 3449US5780162AAluminum nitride substrate and method of producing the sameMITSUBISHI MATERIALS CORP·Filed 1995·Granted Jul 14, 1998·16 cites·18 claims
- 3548US10375825B2Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding pasteMITSUBISHI MATERIALS CORP·Filed 2016·Granted Aug 6, 2019·0 cites·7 claims
- 3647US11380832B2Thermoelectric conversion module and method for producing thermoelectric conversion moduleMITSUBISHI MATERIALS CORP·Filed 2018·Granted Jul 5, 2022·0 cites·7 claims
- 3746US2004234751A1Protective thin film for FPDs, method for producing said thin film and FPDs using said thin filmFiled 2004·Application pending·0 cites
- 3844US10607907B2Ceramic-aluminum conjugate, power module substrate, and power moduleMITSUBISHI MATERIALS CORP·Filed 2016·Granted Mar 31, 2020·0 cites·6 claims
- 3943US2015055302A1Power module substrate with heatsink, power module substrate with cooler and power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Application pending·0 cites
- 4042US5087509ASubstrate used for fabrication of thick film circuitMITSUBISHI METAL CORP·Filed 1990·Granted Feb 11, 1992·13 cites·20 claims
- 4141US2009229864A1Insulating circuit board and insulating circuit board having cooling sinkMITSUBISHI MATERIALS CORP·Filed 2006·Application pending·0 cites
- 4239US2004085266A1Method of forming ceramic capillary rib, ceramic paste used therefor, and apparatus for forming sameMITSUBISHI MATERIALS CORP·Filed 2003·Application pending·0 cites
- 4339US2002155937A1Paste for forming ceramic ribs, production method for the same and forming method of ribs used the sameFiled 2002·Application pending·0 cites
- 4434US5096768ASubstrate used for fabrication of thick film circuitMITSUBISHI METAL CORP·Filed 1990·Granted Mar 17, 1992·7 cites·19 claims
- 4533US2021111327A1Thermoelectric conversion module and method for producing thermoelectric conversion moduleMITSUBISHI MATERIALS CORP·Filed 2018·Application pending·0 cites
- 4628US2002180353A1Method of forming ceramic capillary rib, ceramic paste used therefor, and apparatus for forming sameFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →