Inventor · disambiguated record
Gene Y. Kohara
Also filed as: KOHARA GENE Y
16 granted patents·3 pending applications·511 citations·filing 1998–2016
95Inventor score
Top patents by PatentIndex Score
19 records- 0197US7253109B2Method of depositing a tantalum nitride/tantalum diffusion barrier layer systemAPPLIED MATERIALS INC·Filed 2005·Granted Aug 7, 2007·44 cites·67 claims
- 0297US6919275B2Method of preventing diffusion of copper through a tantalum-comprising barrier layerAPPLIED MATERIALS INC·Filed 2004·Granted Jul 19, 2005·87 cites·4 claims
- 0394US6758947B2Damage-free sculptured coating depositionAPPLIED MATERIALS INC·Filed 2001·Granted Jul 6, 2004·47 cites·29 claims
- 0492US7381639B2Method of depositing a metal seed layer on semiconductor substratesAPPLIED MATERIALS INC·Filed 2006·Granted Jun 3, 2008·10 cites·13 claims
- 0592US5985759AOxygen enhancement of ion metal plasma (IMP) sputter deposited barrier layersAPPLIED MATERIALS INC·Filed 1998·Granted Nov 16, 1999·120 cites·14 claims
- 0691US9390970B2Method for depositing a diffusion barrier layer and a metal conductive layerCHIANG TONY·Filed 2007·Granted Jul 12, 2016·10 cites·69 claims
- 0791US6271592B1Sputter deposited barrier layersAPPLIED MATERIALS INC·Filed 1999·Granted Aug 7, 2001·104 cites·14 claims
- 0890US7074714B2Method of depositing a metal seed layer on semiconductor substratesAPPLIED MATERIALS INC·Filed 2004·Granted Jul 11, 2006·26 cites·3 claims
- 0983US7687909B2Metal / metal nitride barrier layer for semiconductor device applicationsAPPLIED MATERIALS INC·Filed 2007·Granted Mar 30, 2010·7 cites·13 claims
- 1080US7989343B2Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor featuresAPPLIED MATERIALS INC·Filed 2010·Granted Aug 2, 2011·2 cites·13 claims
- 1176US7795138B2Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrateAPPLIED MATERIALS INC·Filed 2009·Granted Sep 14, 2010·2 cites·16 claims
- 1276US6110821AMethod for forming titanium silicide in situAPPLIED MATERIALS INC·Filed 1998·Granted Aug 29, 2000·37 cites·12 claims
- 1373US8158511B2Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor featuresCHIANG TONY·Filed 2011·Granted Apr 17, 2012·1 cites·11 claims
- 1471US6620250B2Method and apparatus for shielding a device from a semiconductor wafer process chamberAPPLIED MATERIALS INC·Filed 2001·Granted Sep 16, 2003·14 cites·22 claims
- 1564US9991157B2Method for depositing a diffusion barrier layer and a metal conductive layerAPPLIED MATERIALS INC·Filed 2016·Granted Jun 5, 2018·0 cites·15 claims
- 1660US7589016B2Method of depositing a sculptured copper seed layerAPPLIED MATERIALS INC·Filed 2008·Granted Sep 15, 2009·0 cites·7 claims
- 1755US2009053888A1Method of depositing a diffusion barrier layer which provides an improved interconnectAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 1848US2005272254A1Method of depositing low resistivity barrier layers for copper interconnectsAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 1946US2005020080A1Method of depositing a diffusion barrier layer and a metal conductive layerFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →