Inventor · disambiguated record
Alfred Yeo
Also filed as: YEO ALFRED · YEO ALFRED SWAIN HONG
4 granted patents·1 pending application·16 citations·filing 2009–2015
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0181US8048761B2Fabricating method for crack stop structure enhancement of integrated circuit seal ringGLOBALFOUNDRIES SG PTE LTD·Filed 2009·Granted Nov 1, 2011·11 cites·20 claims
- 0266US7892963B2Integrated circuit packaging system and method of manufacture thereofGLOBALFOUNDRIES SG PTE LTD·Filed 2009·Granted Feb 22, 2011·4 cites·20 claims
- 0349US8603909B2Integrated circuit packaging system with core region and bond pad and method of manufacture thereofYEO ALFRED·Filed 2009·Granted Dec 10, 2013·1 cites·20 claims
- 0437US2012074519A1Crack stop structure enhancement of the integrated circuit seal ringYEO ALFRED·Filed 2011·Application pending·0 cites
- 0536US9698083B2Three-dimensional stack of leaded package and electronic memberINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 4, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →