Assignee
YEO ALFRED
SG·1 granted patent·1 pending application·1 citations·filing 2009–2011
Top patents by PatentIndex Score
2 records- 0149US8603909B2Integrated circuit packaging system with core region and bond pad and method of manufacture thereofYEO ALFRED·Filed 2009·Granted Dec 10, 2013·1 cites·20 claims
- 0237US2012074519A1Crack stop structure enhancement of the integrated circuit seal ringYEO ALFRED·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →