Inventor · disambiguated record
Tatsuo Suemasu
Also filed as: SUEMASU TATSUO
11 granted patents·6 pending applications·314 citations·filing 2002–2017
91Inventor score
Top patents by PatentIndex Score
17 records- 0193US7274101B2Semiconductor package and method for manufacturing the sameFUJIKURA LTD·Filed 2005·Granted Sep 25, 2007·42 cites·3 claims
- 0293US7180149B2Semiconductor package with through-holeOLYMPUS CORP·Filed 2004·Granted Feb 20, 2007·110 cites·11 claims
- 0393US7022609B2Manufacturing method of a semiconductor substrate provided with a through hole electrodeOLYMPUS OPTICAL CO·Filed 2003·Granted Apr 4, 2006·101 cites·12 claims
- 0482US6743499B2Metal filling method and member with filled metal sectionsFUJIKURA LTD·Filed 2002·Granted Jun 1, 2004·24 cites·3 claims
- 0574US7080560B2Semiconductor pressure sensorFUJIKURA LTD·Filed 2003·Granted Jul 25, 2006·17 cites·59 claims
- 0669US7814651B2Method for fabricating a through-hole interconnection substrateFUJIKURA LTD·Filed 2007·Granted Oct 19, 2010·4 cites·19 claims
- 0769US7217890B2Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrateFUJIKURA LTD·Filed 2003·Granted May 15, 2007·12 cites·15 claims
- 0860US7368321B2Semiconductor package and method for manufacturing the sameFUJIKURA LTD·Filed 2007·Granted May 6, 2008·2 cites·2 claims
- 0959US8564101B2Semiconductor apparatus having a through-hole interconnectionHARADA YOSHIMICHI·Filed 2009·Granted Oct 22, 2013·2 cites·2 claims
- 1047US8652419B2Method of manufacturing microfluidic chip, microfluidic chip, and apparatus for generating surface plasmon resonant lightFUJIKURA LTD·Filed 2013·Granted Feb 18, 2014·0 cites·11 claims
- 1144US2011290545A1Through wiring board and method of manufacturing the sameWADA HIDEYUKI·Filed 2011·Application pending·0 cites
- 1244US2005205997A1Device with through-hole interconnection and method for manufacturing the sameFUJIKURA LTD·Filed 2005·Application pending·0 cites
- 1343US2004187975A1Metal filling method and memeber with filled metal sectionsFUJIKURA LTD·Filed 2004·Application pending·0 cites
- 1442US8273657B2Method for manufacturing a semiconductor apparatus having a through-hole interconnectionHARADA YOSHIMICHI·Filed 2011·Granted Sep 25, 2012·0 cites·4 claims
- 1539US2006113057A1Metal filling process and metal filling apparatusFUJIKURA LTD·Filed 2006·Application pending·0 cites
- 1638US2019327829A1Stretchable boardFUJIKURA LTD·Filed 2017·Application pending·0 cites
- 1734US2010117220A1Semiconductor package and manufacturing method for the sameFUJIKURA LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →