Metal filling method and memeber with filled metal sections
Abstract
In the formation of through wirings in a silicon substrate and so forth, there was a need for the development of a technology that would allow metal to be reliably filled particularly in the vicinity of openings of through holes and other fine holes. This invention provides a metal filling method and member with filled metal sections in which, in the inflow and filling of a plating solution into through holes 11 of a substrate 10 by immersing said substrate 10 in heated and melted conductive metal, filled metal sections are formed by preliminarily forming a metal layer 15 on the inner surface of one of the ends of through holes 11 of this substrate 10 as well as on substrate top surface 13 around those openings, removing substrate 10 on which inflow and filling of the plating solution into through holes 11 has been completed from the plating solution, and then cooling to solidify the plating solution that has been filled into the through holes.
Claims
exact text as granted — not AI-modified1 . A metal filling method comprising: a first step of forming a fine hole in a work piece: a second step of forming a metal layer on an inner surface of one end of said fine hole and a third step of filling a molten metal into said fine hole;
2 . A metal filling method according to claim 1 ,
wherein: said fine hole is a through hole that passes extends through said work piece; in said second step, said metal layer is formed on the inner surface of at least one end of both ends in an axial direction of said through hole: in said third step, by immersing said work piece, into said molten metal, said molten metal is filled into said through hole and the metal filling method further-comprises a fourth step of closing at least one of two openings of said through hole, and a fifth step of removing said work piece out from said molten metal
3 . A metal filling method according to claim 2 ,
wherein: in said second step, said metal layer is further formed on the surface of said work piece and around the opening in said one end in said fifth step, a padding portion which is united with said molten metal filled into said fine hole is formed on said outer surface by removing said work piece out from said molten metal; and the metal filling method further comprises a sixth step of solidifying said molten metal within said fine hole and said molten metal forming said padding portion.
4 . A metal filling method according to claim 1 .
wherein: said work piece is a substrate: and said fine hole is formed as a non-through hole which opens to only one of top and bottom surfaces of said substrate
5 . A metal filling method according to claim 3 , wherein, a shape of said metal layer formed on the outer surface of said work piece is patterned corresponding to a shape of said padding portion to be formed.
6 . (Cancelled)
7 . (Cancelled)
8 . A metal filling method according to claim 1 ,
wherein: said work piece is a substrate; and said fine hole is formed as a through hole, which opens to both top and bottom surfaces of said substrate.Join the waitlist — get patent alerts
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