Inventor · disambiguated record
Mitsumasa Koyanagi
Also filed as: KOYANAGI MITSUMASA
27 granted patents·6 pending applications·567 citations·filing 1976–2018
97Inventor score
Top patents by PatentIndex Score
33 records- 0194US7906363B2Method of fabricating semiconductor device having three-dimensional stacked structureZYCUBE CO LTD·Filed 2005·Granted Mar 15, 2011·41 cites·43 claims
- 0291US4151607ASemiconductor memory deviceHITACHI LTD·Filed 1977·Granted Apr 24, 1979·50 cites·3 claims
- 0389US7550802B2Nonvolatile semiconductor memory device and manufacturing process of the sameASAHI GLASS CO LTD·Filed 2005·Granted Jun 23, 2009·18 cites·4 claims
- 0488US4355374ASemiconductor memory deviceHITACHI LTD·Filed 1980·Granted Oct 19, 1982·45 cites·8 claims
- 0587US7355238B2Nonvolatile semiconductor memory device having nanoparticles for charge retentionASAHI GLASS CO LTD·Filed 2004·Granted Apr 8, 2008·60 cites·12 claims
- 0685US7265402B2Solid-state image sensor including a microlensZYCUBE CO LTD·Filed 2002·Granted Sep 4, 2007·44 cites·19 claims
- 0785US4701349ASemiconductor integrated circuit device and method of producing the sameHITACHI LTD·Filed 1985·Granted Oct 20, 1987·68 cites·15 claims
- 0883US8229539B1Brain probe and method for manufacturing sameMOTOYOSHI MAKOTO·Filed 2011·Granted Jul 24, 2012·19 cites·14 claims
- 0983US6525415B2Three-dimensional semiconductor integrated circuit apparatus and manufacturing method thereforKOYANAGI MITSUMASA·Filed 2000·Granted Feb 25, 2003·41 cites·3 claims
- 1080US8283208B2Method and apparatus for fabricating integrated circuit device using self-organizing functionKOYANAGI MITSUMASA·Filed 2005·Granted Oct 9, 2012·8 cites·38 claims
- 1175US4016007AMethod for fabricating a silicon device utilizing ion-implantation and selective oxidationHITACHI LTD·Filed 1976·Granted Apr 5, 1977·31 cites·9 claims
- 1274US9449948B2Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuitUNIV TOHOKU·Filed 2013·Granted Sep 20, 2016·3 cites·22 claims
- 1374US8349652B2Method and apparatus for manufacturing three-dimensional integrated circuitTOKYO ELECTRON LTD·Filed 2010·Granted Jan 8, 2013·4 cites·11 claims
- 1470US8722460B2Method and apparatus for fabricating integrated circuit device using self-organizing functionKOYANAGI MITSUMASA·Filed 2012·Granted May 13, 2014·2 cites·16 claims
- 1568US7091534B2Semiconductor device using low dielectric constant material film and method of fabricating the sameZYCUBE CO LTD·Filed 2002·Granted Aug 15, 2006·13 cites·14 claims
- 1668US4901128ASemiconductor memoryHITACHI LTD·Filed 1986·Granted Feb 13, 1990·25 cites·21 claims
- 1758US5237528ASemiconductor memoryHITACHI LTD·Filed 1992·Granted Aug 17, 1993·18 cites·9 claims
- 1858US5021842ATrench DRAM cell with different insulator thicknessesHITACHI LTD·Filed 1988·Granted Jun 4, 1991·24 cites·16 claims
- 1957US4891326ASemiconductor device and a process for manufacturing the sameHITACHI LTD·Filed 1988·Granted Jan 2, 1990·22 cites·24 claims
- 2055US10483240B2Semiconductor device and method for manufacturing the sameUNIV TOHOKU·Filed 2018·Granted Nov 19, 2019·0 cites·8 claims
- 2153US5214496ASemiconductor memoryHITACHI LTD·Filed 1989·Granted May 25, 1993·13 cites·42 claims
- 2250US10177118B2Semiconductor device and method for manufacturing the sameUNIV TOHOKU·Filed 2017·Granted Jan 8, 2019·0 cites·21 claims
- 2348US2011249113A1Method and apparatus for fabricating integrated circuit device using self-organizing functionKOYANAGI MITSUMASA·Filed 2011·Application pending·0 cites
- 2447US7820515B2Nonvolatile semiconductor memory element excellent in charge retention properties and process for producing the sameASAHI GLASS CO LTD·Filed 2008·Granted Oct 26, 2010·0 cites·6 claims
- 2546US7326642B2Method of fabricating semiconductor device using low dielectric constant material filmZYCUBE CO LTD·Filed 2006·Granted Feb 5, 2008·0 cites·14 claims
- 2643US5778202ARing bus multiprocessor system and processor boards for constituting the sameFUJI XEROX CO LTD·Filed 1996·Granted Jul 7, 1998·18 cites·13 claims
- 2740US2009115042A1Semiconductor device having three-dimensional stacked structure and method of fabricating the sameZYCUBE CO LTD·Filed 2005·Application pending·0 cites
- 2839US7303990B2Nickel-silicon compound forming method, semiconductor device manufacturing method, and semiconductor deviceSEMICONDUCTOR TECH ACAD RES CT·Filed 2005·Granted Dec 4, 2007·0 cites·24 claims
- 2938US10553455B2Method for aligning chip components relative to substrate by using liquidTOKYO ELECTRON LTD·Filed 2017·Granted Feb 4, 2020·0 cites·12 claims
- 3035US2007155099A1Nonvolatile semiconductor memory device having excellent charge retention and manufacturing process of the sameUNIV TOHOKU·Filed 2007·Application pending·0 cites
- 3133US2015282709A1Brain electrode systemTOHOKU MICROTEC CO LTD·Filed 2015·Application pending·0 cites
- 3231US2006057845A1Method of forming nickel-silicon compound, semiconductor device, and semiconductor device manufacturing methodSEMICONDUCTOR TECH ACAD RES CT·Filed 2005·Application pending·0 cites
- 3330US2004050319A1Nickel-silicon compound forming method, semiconductor device manufacturing method, and semiconductor deviceSEMICONDUCTOR TECH ACAD RES CT·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →