Inventor · disambiguated record
Masakuni Shiozawa
Also filed as: SHIOZAWA MASAKUNI
15 granted patents·9 pending applications·83 citations·filing 2000–2014
91Inventor score
Top patents by PatentIndex Score
24 records- 0183US7256072B2Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Aug 14, 2007·8 cites·2 claims
- 0280US8816709B2Electronic component testing device and electronic component transport methodSHIOZAWA MASAKUNI·Filed 2011·Granted Aug 26, 2014·6 cites·12 claims
- 0379US6391686B1Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2000·Granted May 21, 2002·26 cites·14 claims
- 0470US7562806B2Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic deviceSEIKO EPSON CORP·Filed 2005·Granted Jul 21, 2009·4 cites·6 claims
- 0569US8558570B2Component test apparatus and component transport methodSHIOZAWA MASAKUNI·Filed 2011·Granted Oct 15, 2013·2 cites·13 claims
- 0669US6638785B2Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of makingSEIKO EPSON CORP·Filed 2002·Granted Oct 28, 2003·12 cites·9 claims
- 0767US7888928B2Component test apparatus having a pair of rotary transport handsSEIKO EPSON CORP·Filed 2009·Granted Feb 15, 2011·5 cites·3 claims
- 0862US8008939B2Component test apparatus and component transport methodSEIKO EPSON CORP·Filed 2009·Granted Aug 30, 2011·3 cites·8 claims
- 0962US6566763B2Interconnect substrate, apparatus of applying adhesive material, semiconductor device, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2002·Granted May 20, 2003·9 cites·10 claims
- 1053US7017636B2Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic deviceSEIKO EPSON CORP·Filed 2003·Granted Mar 28, 2006·4 cites·30 claims
- 1149US2007252285A1Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor deviceSHIOZAWA MASAKUNI·Filed 2007·Application pending·0 cites
- 1247US2005184379A1Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor deviceFiled 2005·Application pending·0 cites
- 1346US7410826B2Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic deviceSEIKO EPSON CORP·Filed 2005·Granted Aug 12, 2008·0 cites·22 claims
- 1446US6984125B2Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic deviceSEIKO EPSON CORP·Filed 2003·Granted Jan 10, 2006·2 cites·9 claims
- 1545US7195935B2Selective packaging of tested semiconductor devicesSEIKO EPSON CORP·Filed 2004·Granted Mar 27, 2007·2 cites·13 claims
- 1643US2013181576A1Handler and test apparatusSEIKO EPSON CORP·Filed 2013·Application pending·0 cites
- 1741US2004238948A1Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor deviceFiled 2004·Application pending·0 cites
- 1840US2013027542A1Electronic component carrying device and electronic component carrying methodSEIKO EPSON CORP·Filed 2012·Application pending·0 cites
- 1939US6512294B1Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making the sameSEIKO EPSON CORP·Filed 2000·Granted Jan 28, 2003·0 cites·18 claims
- 2038US7371607B2Method of manufacturing semiconductor device and method of manufacturing electronic deviceSEIKO EPSON CORP·Filed 2004·Granted May 13, 2008·0 cites·13 claims
- 2138US2005098869A1Semiconductor device and method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2004·Application pending·0 cites
- 2237US2004237999A1Electrically conductive material printing apparatus, printing mask cleaning method, and printing mask cleaning programFiled 2004·Application pending·0 cites
- 2336US2014352459A1Drive device, electronic component carrying device, electronic component inspection device, robot hand, and robotSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 2436US2003221853A1Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic deviceFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →