Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Abstract

A method is provided to suppress detachment between semiconductor packages while preventing dislocation at the time of mounting a stacked semiconductor package on a motherboard. Semiconductor packages PK 1 and PK 2 are bonded to each other through protruding electrodes and resin is provided between the semiconductor packages PK 1 and PK 2 . The resin is provided in the peripheries of the protruding electrodes so as to contact each of the protruding electrodes while not contacting a semiconductor chip.

What is claimed is:  
     
         1 . A semiconductor device, comprising: 
 a first semiconductor package having a first semiconductor chip mounted therein;    a second semiconductor package having a second semiconductor chip mounted therein;    a protruding electrode bonding the first semiconductor package to the second semiconductor package so that the second semiconductor package is held above the first semiconductor chip; and    resin provided between the first semiconductor package and the second semiconductor package, at least a part of a surface of the first semiconductor chip being spaced apart from the resin.    
     
     
         2 . The semiconductor device according to  claim 1 , wherein the protruding electrode comprises a solder ball.  
     
     
         3 . The semiconductor device according to  claim 1 , wherein the resin is arranged between the first semiconductor package and the second semiconductor package and spaced apart from the protruding electrode.  
     
     
         4 . The semiconductor device according to  claim 3 , wherein the resin is arranged only at corners of the second semiconductor package.  
     
     
         5 . The semiconductor device according to  claim 3 , wherein the resin contacts a selected region of the first semiconductor package and the second semiconductor package, the selected region being spaced apart from the protruding electrode.  
     
     
         6 . The semiconductor device according to  claim 1 , wherein the resin is arranged so as to contact a periphery of the protruding electrode.  
     
     
         7 . The semiconductor device according to  claim 6 , wherein the resin includes flux.  
     
     
         8 . The semiconductor device according to  claim 1 , wherein: 
 the first semiconductor package comprises: 
 a first carrier substrate; and  
 the first semiconductor chip which is flip-chip mounted on the first carrier substrate; and  
   the second semiconductor package comprises: 
 a second carrier substrate mounted on the first carrier substrate through the protruding electrode so as to be held above the first semiconductor chip;  
 the second semiconductor chip which is mounted on the second carrier substrate; and  
 a sealing agent that seals the second semiconductor chip.  
   
     
     
         9 . The semiconductor device according to  claim 8 , wherein the first semiconductor package comprises a ball grid array where the first semiconductor chip is flip-chip mounted on the first carrier substrate, and the second semiconductor package comprises one of a ball grid array and a chip-size package where the second semiconductor chip mounted on the second carrier substrate is mold-sealed.  
     
     
         10 . An electronic device, comprising: 
 a first package having a first electronic component mounted therein;    a second package having a second electronic component is mounted therein;    a protruding electrode bonding the first package and the second package so that the second package is held above the first electronic component; and    resin provided between the first package and the second package, at least a part of a surface of the first electronic component being spaced apart from the resin.    
     
     
         11 . An electronic apparatus, comprising: 
 a first semiconductor package having a first semiconductor chip mounted therein;    a second semiconductor package having a second semiconductor chip mounted therein;    a protruding electrode bonding the first semiconductor package to the second semiconductor package so that the second semiconductor package is held above the first semiconductor chip;    resin provided between the first semiconductor package and the second semiconductor package, at least a part of a surface of the first semiconductor chip being spaced apart from the resin;    a motherboard mounting the first semiconductor package bonded to the second semiconductor package; and    an electronic component bonded to the first semiconductor chip and the second semiconductor chip through the motherboard.    
     
     
         12 . A method of manufacturing a semiconductor device, comprising: 
 bonding a first semiconductor package having a first semiconductor chip mounted therein to a second semiconductor package having a second semiconductor chip mounted therein through protruding electrodes; and    providing resin between the first semiconductor package and the second semiconductor package, at least a part of a surface of the first semiconductor chip being spaced apart from the resin.    
     
     
         13 . The method of manufacturing the semiconductor device according to  claim 12 , wherein the resin is arranged between the first semiconductor package and the second semiconductor package so as to be spaced apart from the protruding electrode.  
     
     
         14 . The method of manufacturing the semiconductor device according to  claim 13 , wherein the resin is arranged only at corners of the second semiconductor package.  
     
     
         15 . A method of manufacturing a semiconductor device, comprising: 
 providing flux, which contains resin, on lands formed on a first semiconductor package;    arranging solder balls, provided on a second semiconductor package, on lands provided with the flux; and    melting the solder balls to bond the solder balls to the lands by executing a reflow process while making the resin contained in the flux crawl up along surfaces of the solder balls.    
     
     
         16 . A semiconductor device, comprising: 
 a first semiconductor package including a semiconductor chip;    a protruding electrode bonded to the first semiconductor package;    a second semiconductor package bonded to the protruding electrode opposite the first semiconductor package, the second semiconductor package being held above the semiconductor chip and defining a gap between the second semiconductor package and the first semiconductor package; and    resin spanning between the first semiconductor package and the second semiconductor package, the resin being laterally spaced apart from the semiconductor chip so that at least a part of the gap is free of the resin.    
     
     
         17 . The semiconductor device of  claim 16  wherein the resin surrounds a periphery of the protruding electrode.  
     
     
         18 . The semiconductor device of  claim 16  wherein the resin is spaced apart from the protruding electrode.  
     
     
         19 . The semiconductor device of  claim 18  wherein the resin is located inboard the protruding electrode relative to the semiconductor chip.  
     
     
         20 . The semiconductor device of  claim 18  wherein the resin is located outboard the protruding electrode relative to the semiconductor chip.  
     
     
         21 . The semiconductor device of  claim 16  wherein the resin is confined to corners of the second semiconductor package.  
     
     
         22 . The semiconductor device of  claim 16  further comprising second resin spanning between the semiconductor chip and the second package.