Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Abstract

A method is provided to suppress detachment between semiconductor packages while preventing dislocation at the time of mounting a stacked semiconductor package on a motherboard. Semiconductor packages PK 1 and PK 2 are bonded to each other through protruding electrodes and resin is provided between the semiconductor packages PK 1 and PK 2 . The resin is provided in the peripheries of the protruding electrodes so as to contact each of the protruding electrodes while not contacting a semiconductor chip.

1 . A semiconductor device, comprising: 
 a first semiconductor package having a first semiconductor chip mounted therein;    a second semiconductor package having a second semiconductor chip mounted therein;    a protruding electrode bonding the first semiconductor package to the second semiconductor package so that the second semiconductor package is held above the first semiconductor chip; and    resin provided between the first semiconductor package and the second semiconductor package, at least a part of a surface of the first semiconductor chip being spaced apart from the resin, and wherein the resin is arranged between the first semiconductor package and the second semiconductor package and spaced apart from the protruding electrode.    
   
   
       2 . The semiconductor device according to  claim 1 , wherein the resin is arranged only at corners of the second semiconductor package.  
   
   
       3 . The semiconductor device according to  claim 1 , wherein the resin contacts a selected region of the first semiconductor package and the second semiconductor package, the selected region being spaced apart from the protruding electrode.  
   
   
       4 . An electronic apparatus, comprising: 
 a first semiconductor package having a first semiconductor chip mounted therein;    a second semiconductor package having a second semiconductor chip mounted therein;    a protruding electrode bonding the first semiconductor package to the second semiconductor package so that the second semiconductor package is held above the first semiconductor chip;    resin provided between the first semiconductor package and the second semiconductor package, at least a part of a surface of the first semiconductor chip being spaced apart from the resin;    a motherboard mounting the first semiconductor package bonded to the second semiconductor package; and    an electronic component bonded to the first semiconductor chip and the second semiconductor chip through the motherboard.    
   
   
       5 . A semiconductor device, comprising: 
 a first semiconductor package including a semiconductor chip;    a protruding electrode bonded to the first semiconductor package;    a second semiconductor package bonded to the protruding electrode opposite the first semiconductor package, the second semiconductor package being held above the semiconductor chip and defining a gap between the second semiconductor package and the first semiconductor package; and    resin spanning between the first semiconductor package and the second semiconductor package, the resin being laterally spaced apart from the semiconductor chip so that at least a part of the gap is free of the resin, and wherein the resin is spaced apart from the protruding electrode.    
   
   
       6 . The semiconductor device of  claim 5  wherein the resin is located inboard the protruding electrode relative to the semiconductor chip.  
   
   
       7 . The semiconductor device of  claim 5  wherein the resin is located outboard the protruding electrode relative to the semiconductor chip.  
   
   
       8 . The semiconductor device of  claim 5  wherein the resin is confined to corners of the second semiconductor package.  
   
   
       9 . The semiconductor device of  claim 5  further comprising second resin spanning between the semiconductor chip and the second package.