Inventor · disambiguated record
Takeyuki Itabashi
Also filed as: ITABASHI TAKEYUKI
33 granted patents·16 pending applications·782 citations·filing 1992–2010
98Inventor score
Top patents by PatentIndex Score
49 records- 0198US6680540B2Semiconductor device having cobalt alloy film with boronHITACHI LTD·Filed 2001·Granted Jan 20, 2004·205 cites·15 claims
- 0292US5595943AMethod for formation of conductor using electroless platingHITACHI LTD·Filed 1995·Granted Jan 21, 1997·125 cites·3 claims
- 0388US6370768B1Circuit board, a method for manufacturing same, and a method of electroless platingHITACHI LTD·Filed 1998·Granted Apr 16, 2002·71 cites·22 claims
- 0485US7568452B2Engine systemHITACHI LTD·Filed 2007·Granted Aug 4, 2009·15 cites·1 claims
- 0584US7352184B2MRI apparatus with high-resistance magnetHITACHI LTD·Filed 2006·Granted Apr 1, 2008·10 cites·9 claims
- 0683US8368195B2Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chipsHITACHI METALS LTD·Filed 2010·Granted Feb 5, 2013·9 cites·6 claims
- 0783US8197752B2Managing system and method for emissions of environmental pollutantsNOJIMA MASAFUMI·Filed 2006·Granted Jun 12, 2012·18 cites·9 claims
- 0882US7805271B2Evaluation system for amount of emission gases through fuel supply chainHITACHI LTD·Filed 2008·Granted Sep 28, 2010·15 cites·9 claims
- 0981US6326561B1Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layerHITACHI LTD·Filed 1996·Granted Dec 4, 2001·39 cites·39 claims
- 1081US6300244B1Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Oct 9, 2001·57 cites·18 claims
- 1180US7226690B2Catalyst material and method of manufacturing the same and fuel cell using the sameHITACHI LTD·Filed 2005·Granted Jun 5, 2007·4 cites·15 claims
- 1280US6805915B2Electroless copper plating solution, electroless copper plating process and production process of circuit boardHITACHI LTD·Filed 2002·Granted Oct 19, 2004·15 cites·8 claims
- 1378US6495769B1Wiring board and production method thereof, and semiconductor apparatusHITACHI LTD·Filed 2000·Granted Dec 17, 2002·17 cites·20 claims
- 1476US8307863B2Fuel filling and waste solution recovery apparatus and fuel vesselNOUJIMA MASAFUMI·Filed 2008·Granted Nov 13, 2012·6 cites·19 claims
- 1575US7667343B2Hydrogen production system using wind turbine generatorHITACHI LTD·Filed 2007·Granted Feb 23, 2010·13 cites·6 claims
- 1675US7527660B2Hydrogen fuel manufacturing method and system with control program for use thereinHITACHI LTD·Filed 2005·Granted May 5, 2009·3 cites·11 claims
- 1774US6511588B1Plating method using an additiveHITACHI LTD·Filed 2000·Granted Jan 28, 2003·19 cites·7 claims
- 1872US8053908B2Semiconductor deviceHITACHI METALS LTD·Filed 2010·Granted Nov 8, 2011·4 cites·7 claims
- 1972US7235324B2Catalyst material and method of manufacturing the same and fuel cell using the sameHITACHI LTD·Filed 2004·Granted Jun 26, 2007·10 cites·19 claims
- 2071US6815357B2Process and apparatus for manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Nov 9, 2004·16 cites·25 claims
- 2171US5457079ACopper-based oxidation catalyst and its applicationsHITACHI LTD·Filed 1993·Granted Oct 10, 1995·25 cites·15 claims
- 2269US8109286B2Fuel tank including movable or deformable fuel chamber and waste chamberNOJIMA MASAFUMI·Filed 2007·Granted Feb 7, 2012·2 cites·12 claims
- 2369US8020745B2Solder ballHITACHI METALS LTD·Filed 2009·Granted Sep 20, 2011·2 cites·6 claims
- 2469US6190493B1Thin-film multilayer wiring board and production thereofHITACHI LTD·Filed 1997·Granted Feb 20, 2001·31 cites·16 claims
- 2567US6831009B2Wiring substrate and an electroless copper plating solution for providing interlayer connectionsHITACHI LTD·Filed 2001·Granted Dec 14, 2004·7 cites·4 claims
- 2664US7806991B2Low loss magnet and magnetic circuit using the sameHITACHI LTD·Filed 2006·Granted Oct 5, 2010·3 cites·19 claims
- 2764US6900394B1Electroless copper plating machine, and multi-layer printed wiring boardHITACHI LTD·Filed 2000·Granted May 31, 2005·5 cites·4 claims
- 2863US7169216B2Electroless copper plating solution, electroless copper plating process and production process of circuit boardHITACHI LTD·Filed 2004·Granted Jan 30, 2007·4 cites·3 claims
- 2961US2007079727A1Electroless copper plating solution, electroless copper plating process and production process of circuit boardITABASHI TAKEYUKI·Filed 2006·Application pending·0 cites
- 3059US5294291AProcess for the formation of a conductive circuit patternHITACHI LTD·Filed 1992·Granted Mar 15, 1994·24 cites·36 claims
- 3152US6989329B2Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connectionsHITACHI LTD·Filed 2004·Granted Jan 24, 2006·3 cites·2 claims
- 3249US2006102485A1Electroless plating method, electroless plating device, and production method and production device of semiconductor deviceHITACHI LTD·Filed 2006·Application pending·0 cites
- 3348US2011005473A1Hydrogen Supply Device and Hydrogen Supplying MethodISHIKAWA TAKAO·Filed 2010·Application pending·0 cites
- 3448US2006204799A1Hydrogen supply device and hydrogen supplying methodISHIKAWA TAKAO·Filed 2006·Application pending·0 cites
- 3547US7847555B2MRI apparatus with high-resistance magnetHITACHI LTD·Filed 2008·Granted Dec 7, 2010·0 cites·3 claims
- 3646US2002084191A1Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using sameFiled 2001·Application pending·0 cites
- 3745US2005271828A1Wiring board and production method thereof, and semiconductor apparatusSAITO TOSHIRO·Filed 2005·Application pending·0 cites
- 3844US2005022745A1Electroless plating method, electroless plating device, and production method and production device of semiconductor deviceHITACHI LTD·Filed 2004·Application pending·0 cites
- 3944US2010266929A1Catalyst having a dehydrogenation function or hydrogenation function, fuel cell using the catalyst and hydrogen storage/supply deviceKANEMOTO HIROSHI·Filed 2006·Application pending·0 cites
- 4043US2005087447A1Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using sameFiled 2004·Application pending·0 cites
- 4142US2008202449A1Engine SystemHITACHI LTD·Filed 2008·Application pending·0 cites
- 4241US2002148733A1Wiring board and production method thereof, and semiconductor apparatusFiled 2002·Application pending·0 cites
- 4340US2005029662A1Semiconductor production methodFiled 2004·Application pending·0 cites
- 4439US7579275B2Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor deviceHITACHI LTD·Filed 2002·Granted Aug 25, 2009·0 cites·7 claims
- 4539US2003085467A1Plating method, plating solution, semiconductor device and process for producing the sameFiled 2002·Application pending·0 cites
- 4638US5788821ACopper-based oxidation catalyst and its applicationHITACHI LTD·Filed 1997·Granted Aug 4, 1998·5 cites·3 claims
- 4737US2002030283A1Semiconductor device having wires and insulator layers with via-studsFiled 2001·Application pending·0 cites
- 4837US2003183120A1Electroless copper plating solution, the electroless copper plating supplementary solution, and the method of manufacturing wiring boardFiled 2002·Application pending·0 cites
- 4932US2007044835A1Semiconductor electrode, dye sensitized solar cells and manufacturing method of the sameYOSHIMOTO NAOKI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →