Wiring board and production method thereof, and semiconductor apparatus

Abstract

Provided is a wiring board and production method thereof, wherein production of wiring by a fall additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.

What is claimed is:  
     
         1 . A method for producing a wiring board wherein a wiring is provided on an insulating resin substrate using copper as a conductor, comprising the steps of: 
 (1) providing plasma treatment on a surface of said insulating resin substrate, the insulating resin substrate comprising a resin where the velocity of dissolving the resin in a mixture solution of hydrazine and ethylenediamine mixed at a ratio of 7 to 3 does not exceed 1 μm/min. at a solution temperature of 30°;    (2) providing a metallic layer of a metal having a reduction potential more base than that of copper on the plasma-treated surface of said resin substrate by electroless plating;    (3) forming an oxide layer of said metal of the metallic layer at the interface between said metallic layer and said resin substrate in contact therewith; and    (4) forming a copper layer on said metallic layer by electroless plating.    
     
     
         2 . A method for producing a wiring board according to  claim 1 , further including a step of providing plating catalyst on the plasma-treated surface of said resin substrate and a step of forming a plated resist, between the step of providing said plasma treatment and the step of providing a metallic layer on the plasma-treated surface of said resin substrate.  
     
     
         3 . A method for producing a wiring board wherein a wiring is provided on a resin substrate using copper as a conductor of the wiring, comprising the steps of: 
 (1) using aqueous solution containing alkaline metallic hydroxide to form a layer containing amide group by hydrophilic treatment of the surface of the resin substrate, the resin substrate being made up of a resin where the velocity of dissolving the resin in a mixture solution of hydrazine and ethylenediamine mixed at a ratio of 7 to 3 does not exceed 1 μm/min. at a solution temperature of 30° C;    (2) causing a metal film having a reduction potential more base than that of copper to be deposited on the layer containing said amide group;    (3) causing a metallic oxide film to be formed on the surface of said metal film at the interface between said metal film and said layer containing amide group; and    (4) electroless plating on said metal film, thereby causing copper to be deposited.