Inventor · disambiguated record
Yuichi Nakayoshi
Also filed as: NAKAYOSHI YUICHI
11 granted patents·1 pending application·170 citations·filing 1996–2010
90Inventor score
Top patents by PatentIndex Score
12 records- 0183US8296961B2Polishing pad thickness measuring method and polishing pad thickness measuring deviceNAKAYOSHI YUICHI·Filed 2010·Granted Oct 30, 2012·9 cites·20 claims
- 0281US5863829AProcess for fabricating SOI substrateKOMATSU DENSHI KINZOKU KK·Filed 1996·Granted Jan 26, 1999·61 cites·4 claims
- 0368US8728942B2Method for producing epitaxial silicon waferOGATA SHINICHI·Filed 2010·Granted May 20, 2014·3 cites·2 claims
- 0465US6090688AMethod for fabricating an SOI substrateKOMATSU DENSHI KINZOKU KK·Filed 1996·Granted Jul 18, 2000·31 cites·2 claims
- 0558US5893755AMethod of polishing a semiconductor waferKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted Apr 13, 1999·22 cites·6 claims
- 0656US6001007ATemplate used for polishing a semiconductor waferKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted Dec 14, 1999·18 cites·4 claims
- 0754US8545712B2Semiconductor wafer manufacturing methodTAKAI HIROSHI·Filed 2008·Granted Oct 1, 2013·1 cites·6 claims
- 0850US6004860ASOI substrate and a method for fabricating the sameKOMATSU DENSHI KINZOKU KK·Filed 1996·Granted Dec 21, 1999·15 cites·7 claims
- 0944US9073173B2Method for shape modification of polishing padTAKAI HIROSHI·Filed 2010·Granted Jul 7, 2015·0 cites·8 claims
- 1039US6517667B1Apparatus for polishing a semiconductor waferKOMATSU DENSHI KINZOKU KK·Filed 1998·Granted Feb 11, 2003·8 cites·14 claims
- 1131US6495465B2Method for appraising the condition of a semiconductor polishing clothKOMATSU DENSHI KINZOKU KK·Filed 1999·Granted Dec 17, 2002·2 cites·31 claims
- 1228US2012149177A1Method of producing epitaxial silicon waferNAKAYOSHI YUICHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →