Inventor · disambiguated record
J. Mike Brooks
Also filed as: BROOKS J M · BROOKS J MIKE
19 granted patents·2 pending applications·650 citations·filing 1994–2005
96Inventor score
Technology areasH10W
Top patents by PatentIndex Score
21 records- 0194US8092734B2Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagersJIANG TONGBI·Filed 2004·Granted Jan 10, 2012·95 cites·55 claims
- 0294US6066514AAdhesion enhanced semiconductor die for mold compound packagingMICRON TECHNOLOGY INC·Filed 1997·Granted May 23, 2000·113 cites·18 claims
- 0393US5824569ASemiconductor device having ball-bonded padsMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 20, 1998·123 cites·20 claims
- 0492US5496775ASemiconductor device having ball-bonded padsMICRON SEMICONDUCTOR INC·Filed 1994·Granted Mar 5, 1996·148 cites·21 claims
- 0587US6043564ASemiconductor device having ball-bonded padsMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 28, 2000·67 cites·27 claims
- 0672US5583372AAdhesion enhanced semiconductor die for mold compound packagingMICRON TECHNOLOGY INC·Filed 1994·Granted Dec 10, 1996·37 cites·11 claims
- 0771US7312101B2Packaged microelectronic devices and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 25, 2007·12 cites·55 claims
- 0867US6420214B1Method of forming an integrated circuit device having cyanate ester buffer coatMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 16, 2002·10 cites·12 claims
- 0957US6740545B2Adhesion enhanced semiconductor die for mold compound packagingMICRON TECHNOLOGY INC·Filed 2002·Granted May 25, 2004·4 cites·20 claims
- 1057US6489186B2Adhesion enhanced semiconductor die for mold compound packagingMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 3, 2002·4 cites·20 claims
- 1154US6362532B1Semiconductor device having ball-bonded padsMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 26, 2002·4 cites·17 claims
- 1253US5760468AAdhesion enhanced semiconductor die for mold compound packagingMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 2, 1998·15 cites·26 claims
- 1350US2005253243A1Semiconductor device structure with adhesion-enhanced semiconductor dieKING JERROLD L·Filed 2005·Application pending·0 cites
- 1448US6699734B2Method and apparatus for coupling a semiconductor die to die terminalsMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 2, 2004·2 cites·13 claims
- 1545US6559519B2Integrated circuit device having cyanate ester buffer coat and method of fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted May 6, 2003·1 cites·10 claims
- 1645US6316292B1Adhesion enhanced semiconductor die for mold compound packagingMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 13, 2001·7 cites·18 claims
- 1743US2005001295A1Adhesion enhanced semiconductor die for mold compound packagingFiled 2004·Application pending·0 cites
- 1840US6579746B2Method and apparatus for coupling a semiconductor die to die terminalsMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 17, 2003·0 cites·15 claims
- 1938US5903046AIntegrated circuit device having cyanate ester buffer coatMICRON TECHNOLOGY INC·Filed 1996·Granted May 11, 1999·5 cites·11 claims
- 2033US6060343AMethod of forming an integrated circuit device having cyanate ester buffer coatMICRON TECHNOLOGY INC·Filed 1999·Granted May 9, 2000·2 cites·16 claims
- 2131US6600215B1Method and apparatus for coupling a semiconductor die to die terminalsMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 29, 2003·1 cites·76 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →