Inventor · disambiguated record
Qin-Yi Tong
Also filed as: TONG QIN · TONG QIN-YI
44 granted patents·2 pending applications·3,895 citations·filing 1995–2022
99Inventor score
Files withZIPTRONIX INC26INVENSAS BONDING TECH INC8TONG QIN-YI5ZIPTRONIX2ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC1
Top patents by PatentIndex Score
46 records- 0199US10434749B2Method of room temperature covalent bondingINVENSAS BONDING TECH INC·Filed 2014·Granted Oct 8, 2019·60 cites·16 claims
- 0299US10147641B23D IC method and deviceINVENSAS BONDING TECH INC·Filed 2017·Granted Dec 4, 2018·47 cites·24 claims
- 0399US9391143B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2015·Granted Jul 12, 2016·117 cites·33 claims
- 0499US9331149B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2015·Granted May 3, 2016·185 cites·60 claims
- 0599US9171756B23D IC method and deviceZIPTRONIX INC·Filed 2014·Granted Oct 27, 2015·232 cites·33 claims
- 0699US8841002B2Method of room temperature covalent bondingTONG QIN-YI·Filed 2012·Granted Sep 23, 2014·198 cites·18 claims
- 0799US7485968B23D IC method and deviceZIPTRONIX INC·Filed 2005·Granted Feb 3, 2009·433 cites·41 claims
- 0899US7109092B2Method of room temperature covalent bondingZIPTRONIX INC·Filed 2003·Granted Sep 19, 2006·331 cites·50 claims
- 0999US6902987B1Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2000·Granted Jun 7, 2005·227 cites·147 claims
- 1098US9716033B23D IC method and deviceZIPTRONIX INC·Filed 2015·Granted Jul 25, 2017·29 cites·22 claims
- 1198US9385024B2Room temperature metal direct bondingZIPTRONIX INC·Filed 2014·Granted Jul 5, 2016·211 cites·16 claims
- 1298US8524533B2Room temperature metal direct bondingTONG QIN-YI·Filed 2010·Granted Sep 3, 2013·217 cites·25 claims
- 1398US7041178B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2003·Granted May 9, 2006·129 cites·44 claims
- 1498US6962835B2Method for room temperature metal direct bondingZIPTRONIX INC·Filed 2003·Granted Nov 8, 2005·235 cites·176 claims
- 1598US6563133B1Method of epitaxial-like wafer bonding at low temperature and bonded structureZIPTRONIX INC·Filed 2000·Granted May 13, 2003·185 cites·60 claims
- 1697US9082627B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2014·Granted Jul 14, 2015·20 cites·47 claims
- 1797US8153505B2Method for low temperature bonding and bonded structureTONG QIN-YI·Filed 2010·Granted Apr 10, 2012·27 cites·230 claims
- 1897US7807549B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2007·Granted Oct 5, 2010·41 cites·112 claims
- 1997US7553744B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2007·Granted Jun 30, 2009·35 cites·51 claims
- 2097US6822326B2Wafer bonding hermetic encapsulationZIPTRONIX·Filed 2002·Granted Nov 23, 2004·175 cites·39 claims
- 2196US11289372B23D IC method and deviceINVENSAS BONDING TECH INC·Filed 2021·Granted Mar 29, 2022·2 cites·30 claims
- 2296US8163373B2Method of room temperature covalent bondingTONG QIN-YI·Filed 2010·Granted Apr 24, 2012·18 cites·18 claims
- 2396US7602070B2Room temperature metal direct bondingZIPTRONIX INC·Filed 2005·Granted Oct 13, 2009·33 cites·110 claims
- 2496US7387944B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2004·Granted Jun 17, 2008·68 cites·96 claims
- 2595US8709938B23D IC method and deviceZIPTRONIX INC·Filed 2013·Granted Apr 29, 2014·13 cites·19 claims
- 2695US7462552B2Method of detachable direct bonding at low temperaturesZIPTRONIX INC·Filed 2005·Granted Dec 9, 2008·42 cites·78 claims
- 2794US11011418B23D IC method and deviceINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·5 cites·36 claims
- 2894US7622324B2Wafer bonding hermetic encapsulationZIPTRONIX·Filed 2004·Granted Nov 24, 2009·85 cites·95 claims
- 2994US6150239AMethod for the transfer of thin layers monocrystalline material onto a desirable substrateMAX PLANCK SOC·Filed 1998·Granted Nov 21, 2000·263 cites·31 claims
- 3093US8389378B23D IC method and deviceENQUIST PAUL M·Filed 2008·Granted Mar 5, 2013·20 cites·29 claims
- 3193US7871898B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2010·Granted Jan 18, 2011·9 cites·38 claims
- 3293US7335572B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2004·Granted Feb 26, 2008·39 cites·163 claims
- 3392US7335996B2Method of room temperature covalent bondingZIPTRONIX INC·Filed 2006·Granted Feb 26, 2008·15 cites·11 claims
- 3491US10141218B2Room temperature metal direct bondingINVENSAS BONDING TECH INC·Filed 2015·Granted Nov 27, 2018·5 cites·15 claims
- 3590US7862885B2Method of room temperature covalent bondingZIPTRONIX INC·Filed 2007·Granted Jan 4, 2011·11 cites·29 claims
- 3689US10312217B2Method for low temperature bonding and bonded structureINVENSAS BONDING TECH INC·Filed 2016·Granted Jun 4, 2019·3 cites·31 claims
- 3789US7842540B2Room temperature metal direct bondingZIPTRONIX INC·Filed 2007·Granted Nov 30, 2010·11 cites·16 claims
- 3888US11515202B23D IC method and deviceADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Nov 29, 2022·1 cites·20 claims
- 3988US8053329B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2009·Granted Nov 8, 2011·7 cites·79 claims
- 4085US5915193AMethod for the cleaning and direct bonding of solidsFiled 1995·Granted Jun 22, 1999·82 cites·7 claims
- 4183US8846450B2Room temperature metal direct bondingZIPTRONIX INC·Filed 2013·Granted Sep 30, 2014·5 cites·13 claims
- 4283US7332410B2Method of epitaxial-like wafer bonding at low temperature and bonded structureZIPTRONIX INC·Filed 2003·Granted Feb 19, 2008·23 cites·94 claims
- 4380US11760059B2Method of room temperature covalent bondingINVENSAS BONDING TECH INC·Filed 2019·Granted Sep 19, 2023·1 cites·9 claims
- 4462US2019115247A1Room temperature metal direct bondingINVENSAS BONDING TECH INC·Filed 2018·Application pending·0 cites
- 4556US2012097638A1Method For Low Temperature Bonding And Bonded StructureTONG QIN-YI·Filed 2011·Application pending·0 cites
- 4651US12402605B2Predictive control system and regulatory method for temperature of livestock houseUNIV CHINA AGRICULTURAL·Filed 2022·Granted Sep 2, 2025·0 cites·5 claims
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