Assignee
ZIPTRONIX INC
US·42 granted patents·4,245 citations·filing 1999–2016
Top patents by PatentIndex Score
42 records- 0199US9391143B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2015·Granted Jul 12, 2016·117 cites·33 claims
- 0299US9331149B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2015·Granted May 3, 2016·185 cites·60 claims
- 0399US9184125B2Heterogeneous annealing method and deviceZIPTRONIX INC·Filed 2013·Granted Nov 10, 2015·205 cites·23 claims
- 0499US9171756B23D IC method and deviceZIPTRONIX INC·Filed 2014·Granted Oct 27, 2015·232 cites·33 claims
- 0599US7485968B23D IC method and deviceZIPTRONIX INC·Filed 2005·Granted Feb 3, 2009·433 cites·41 claims
- 0699US7126212B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2001·Granted Oct 24, 2006·247 cites·56 claims
- 0799US7109092B2Method of room temperature covalent bondingZIPTRONIX INC·Filed 2003·Granted Sep 19, 2006·331 cites·50 claims
- 0899US6902987B1Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2000·Granted Jun 7, 2005·227 cites·147 claims
- 0999US6867073B1Single mask via method and deviceZIPTRONIX INC·Filed 2003·Granted Mar 15, 2005·216 cites·48 claims
- 1098US9716033B23D IC method and deviceZIPTRONIX INC·Filed 2015·Granted Jul 25, 2017·29 cites·22 claims
- 1198US9564414B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2015·Granted Feb 7, 2017·37 cites·22 claims
- 1298US9431368B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2016·Granted Aug 30, 2016·194 cites·19 claims
- 1398US9385024B2Room temperature metal direct bondingZIPTRONIX INC·Filed 2014·Granted Jul 5, 2016·211 cites·16 claims
- 1498US7041178B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2003·Granted May 9, 2006·129 cites·44 claims
- 1598US6962835B2Method for room temperature metal direct bondingZIPTRONIX INC·Filed 2003·Granted Nov 8, 2005·235 cites·176 claims
- 1698US6563133B1Method of epitaxial-like wafer bonding at low temperature and bonded structureZIPTRONIX INC·Filed 2000·Granted May 13, 2003·185 cites·60 claims
- 1798US6500694B1Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2000·Granted Dec 31, 2002·156 cites·37 claims
- 1897US9082627B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2014·Granted Jul 14, 2015·20 cites·47 claims
- 1997US7807549B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2007·Granted Oct 5, 2010·41 cites·112 claims
- 2097US7553744B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2007·Granted Jun 30, 2009·35 cites·51 claims
- 2197US6984571B1Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 1999·Granted Jan 10, 2006·162 cites·80 claims
- 2297US6864585B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2002·Granted Mar 8, 2005·114 cites·99 claims
- 2396US7602070B2Room temperature metal direct bondingZIPTRONIX INC·Filed 2005·Granted Oct 13, 2009·33 cites·110 claims
- 2496US7387944B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2004·Granted Jun 17, 2008·68 cites·96 claims
- 2595US8709938B23D IC method and deviceZIPTRONIX INC·Filed 2013·Granted Apr 29, 2014·13 cites·19 claims
- 2695US7462552B2Method of detachable direct bonding at low temperaturesZIPTRONIX INC·Filed 2005·Granted Dec 9, 2008·42 cites·78 claims
- 2795US6627531B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2001·Granted Sep 30, 2003·73 cites·118 claims
- 2894US9698126B2Heterogeneous annealing method and deviceZIPTRONIX INC·Filed 2015·Granted Jul 4, 2017·7 cites·9 claims
- 2993US7871898B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2010·Granted Jan 18, 2011·9 cites·38 claims
- 3093US7335572B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2004·Granted Feb 26, 2008·39 cites·163 claims
- 3193US7037755B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2002·Granted May 2, 2006·58 cites·50 claims
- 3292US7335996B2Method of room temperature covalent bondingZIPTRONIX INC·Filed 2006·Granted Feb 26, 2008·15 cites·11 claims
- 3390US7862885B2Method of room temperature covalent bondingZIPTRONIX INC·Filed 2007·Granted Jan 4, 2011·11 cites·29 claims
- 3490US6905557B2Three dimensional integrated deviceZIPTRONIX INC·Filed 2002·Granted Jun 14, 2005·33 cites·45 claims
- 3589US7842540B2Room temperature metal direct bondingZIPTRONIX INC·Filed 2007·Granted Nov 30, 2010·11 cites·16 claims
- 3688US8053329B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2009·Granted Nov 8, 2011·7 cites·79 claims
- 3786US6740909B2Self aligned symmetric intrinsic process and deviceZIPTRONIX INC·Filed 2001·Granted May 25, 2004·29 cites·36 claims
- 3883US8846450B2Room temperature metal direct bondingZIPTRONIX INC·Filed 2013·Granted Sep 30, 2014·5 cites·13 claims
- 3983US7332410B2Method of epitaxial-like wafer bonding at low temperature and bonded structureZIPTRONIX INC·Filed 2003·Granted Feb 19, 2008·23 cites·94 claims
- 4081US7714446B2Single mask via method and deviceZIPTRONIX INC·Filed 2008·Granted May 11, 2010·7 cites·22 claims
- 4173US7341938B2Single mask via method and deviceZIPTRONIX INC·Filed 2004·Granted Mar 11, 2008·14 cites·30 claims
- 4257US7956447B2Wafer scale die handlingZIPTRONIX INC·Filed 2004·Granted Jun 7, 2011·7 cites·57 claims
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