Inventor · disambiguated record
Kazuhiro Yoshimoto
Also filed as: YOSHIMOTO KAZUHIRO
26 granted patents·5 pending applications·255 citations·filing 1990–2023
96Inventor score
Files withFUJITSU LTD9SHARP KK6FUJITSU SEMICONDUCTOR LTD5FUJITSU MICROELECTRONICS LTD3FUKAYA HIRONORI2
Top patents by PatentIndex Score
31 records- 0194US6824643B2Method and device of peeling semiconductor device using annular contact membersFUJITSU LTD·Filed 2002·Granted Nov 30, 2004·85 cites·2 claims
- 0292US7857140B2Semiconductor wafer storage case and semiconductor wafer storing methodFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Dec 28, 2010·20 cites·4 claims
- 0386US6837776B2Flat-object holder and method of using the sameFUJITSU LTD·Filed 2002·Granted Jan 4, 2005·35 cites·10 claims
- 0485US7479627B2Semiconductor device having transparent member and manufacturing method of the sameFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Jan 20, 2009·14 cites·11 claims
- 0585US7395847B2Jig for a semiconductor substrateFUJITSU LTD·Filed 2005·Granted Jul 8, 2008·9 cites·3 claims
- 0683US7770500B2Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing methodMITSUBOSHI DIAMOND IND CO LTD·Filed 2005·Granted Aug 10, 2010·9 cites·22 claims
- 0783US7426883B2Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting methodMITSUBOSHI DIAMOND IND CO LTD·Filed 2003·Granted Sep 23, 2008·17 cites·18 claims
- 0881US9010615B2Bonding apparatus and bonding methodFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Apr 21, 2015·3 cites·8 claims
- 0979US7820487B2Manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Oct 26, 2010·6 cites·17 claims
- 1076US8795619B2Catalyst for purification of exhaust gas, and apparatus and method for purification of exhaust gas using the catalystSUZUKI TADASHI·Filed 2008·Granted Aug 5, 2014·4 cites·10 claims
- 1175US7432114B2Semiconductor device manufacturing methodFUJITSU LTD·Filed 2006·Granted Oct 7, 2008·6 cites·12 claims
- 1274US7109561B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2005·Granted Sep 19, 2006·4 cites·1 claims
- 1373US8345303B2Image processing apparatusSHARP KK·Filed 2009·Granted Jan 1, 2013·3 cites·7 claims
- 1473US6750074B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2002·Granted Jun 15, 2004·13 cites·12 claims
- 1571US7571538B2Vacuum fixing jig for semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Aug 11, 2009·3 cites·1 claims
- 1662US8016973B2Film bonding method, film bonding apparatus, and semiconductor device manufacturing methodFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Sep 13, 2011·2 cites·5 claims
- 1759US12307145B2Output system for outputting content acquired from server device and terminal device for outputting reception slip to be used in output of contentSHARP KK·Filed 2023·Granted May 20, 2025·0 cites·12 claims
- 1859US6902944B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2004·Granted Jun 7, 2005·5 cites·4 claims
- 1953US2011011919A1Bonding apparatus and bonding methodFUJITSU SEMICONDUCTOR LTD·Filed 2010·Application pending·0 cites
- 2052US2007215673A1Bonding apparatus and bonding methodFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2151US2024129413A1Mfp systemSHARP KK·Filed 2023·Application pending·0 cites
- 2250US11886762B2Printing control systemSHARP KK·Filed 2022·Granted Jan 30, 2024·0 cites·19 claims
- 2350US11809754B2Printing control systemSHARP KK·Filed 2022·Granted Nov 7, 2023·0 cites·12 claims
- 2450US11762615B2Printing system and control method of printing systemSHARP KK·Filed 2022·Granted Sep 19, 2023·0 cites·4 claims
- 2546US6951800B2Method of making semiconductor device that has improved structural strengthFUJITSU LTD·Filed 2002·Granted Oct 4, 2005·1 cites·1 claims
- 2643US5145753ASolid electrolyte fuel cellMITSUBISHI HEAVY IND LTD·Filed 1990·Granted Sep 8, 1992·16 cites·19 claims
- 2743US2005085171A1Flat-object holder and method of using the sameFiled 2004·Application pending·0 cites
- 2842US7655505B2Manufacturing method of semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Feb 2, 2010·0 cites·5 claims
- 2939US8440545B2Method of manufacturing semiconductor device with spraying fluidFUKAYA HIRONORI·Filed 2008·Granted May 14, 2013·0 cites·14 claims
- 3034US2007214925A1Substrate dicing system, substrate manufacturing apparatus, and substrate dicing methodMITSUBISHI DIAMOND IND CO LTD·Filed 2004·Application pending·0 cites
- 3126US8444799B2Method for manufacturing semiconductor device and surface protective tapeFUKAYA HIRONORI·Filed 2010·Granted May 21, 2013·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →