Inventor · disambiguated record
Ho-Geon Song
Also filed as: SONG HO-GEON
25 granted patents·10 pending applications·141 citations·filing 2006–2020
95Inventor score
Top patents by PatentIndex Score
35 records- 0197US8592991B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·31 cites·30 claims
- 0293US8455301B2Method of fabricating stacked chips in a semiconductor packageLEE TEAK-HOON·Filed 2011·Granted Jun 4, 2013·25 cites·26 claims
- 0392US9343361B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 17, 2016·11 cites·16 claims
- 0492US9099460B2Stack semiconductor package and manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 4, 2015·12 cites·13 claims
- 0590US10756062B2Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·6 cites·20 claims
- 0689US9941196B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO JIN·Filed 2016·Granted Apr 10, 2018·5 cites·16 claims
- 0786US11495576B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·19 claims
- 0886US8637350B2Method of manufacturing chip-stacked semiconductor packageAHN JUNG-SEOK·Filed 2012·Granted Jan 28, 2014·9 cites·20 claims
- 0984US8637969B2Stacked chips in a semiconductor packageLEE TEAK-HOON·Filed 2013·Granted Jan 28, 2014·7 cites·10 claims
- 1082US8890294B2Stack semiconductor package and manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 18, 2014·5 cites·6 claims
- 1178US8697494B2Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the methodJEON CHANG-SEONG·Filed 2011·Granted Apr 15, 2014·5 cites·13 claims
- 1277US8189342B2Printed circuit board for memory module, method of manufacturing the same and memory module/socket assemblyBANG HYO-JAE·Filed 2006·Granted May 29, 2012·8 cites·10 claims
- 1373US7576438B2Printed circuit board and method thereof and a solder ball land and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·5 cites·32 claims
- 1470US9136260B2Method of manufacturing chip-stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 1569US8420450B2Method of molding semiconductor packageKO JUN-YOUNG·Filed 2011·Granted Apr 16, 2013·2 cites·12 claims
- 1662US8053351B2Method of forming at least one bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Nov 8, 2011·2 cites·16 claims
- 1761US8431442B2Methods of manufacturing semiconductor chipsPARK SANG WOOK·Filed 2011·Granted Apr 30, 2013·1 cites·20 claims
- 1859US8039972B2Printed circuit board and method thereof and a solder ball land and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 18, 2011·1 cites·32 claims
- 1958US8193619B2Lead frame and semiconductor package having the sameKIM GEUN-WOO·Filed 2010·Granted Jun 5, 2012·2 cites·16 claims
- 2055US8956921B2Method of molding semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·0 cites·19 claims
- 2153US9184065B2Method of molding semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 10, 2015·0 cites·7 claims
- 2251US2014196280A1Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the methodSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2348US10896879B2Semiconductor package having reflective layer with selective transmittanceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 19, 2021·0 cites·16 claims
- 2446US9159680B2Method of fabricating semiconductor devicePARK SANG-WOOK·Filed 2012·Granted Oct 13, 2015·0 cites·15 claims
- 2546US8927340B2Double-sided adhesive tape, semiconductor packages, and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·0 cites·16 claims
- 2642US2013292846A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2742US2009134510A1Semiconductor package and method of fabricating the same, and electronic device using the semiconductor packageKIM HAK-SUNG·Filed 2008·Application pending·0 cites
- 2840US2019139921A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 2940US2012199968A1Semiconductor packagePARK SANG-WOOK·Filed 2012·Application pending·0 cites
- 3038US2011293903A1Wave soldering apparatus to apply buoyancy, soldering method, and method of forming solder bumps for flip chips on a substrateJUNG KY-HYUN·Filed 2011·Application pending·0 cites
- 3138US2007023487A1Wire bonding method and device of performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3238US2013208426A1Semiconductor package having heat spreader and method of forming the sameKIM JAE-CHOON·Filed 2012·Application pending·0 cites
- 3337US8586477B2Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor packageJEONG SE-YOUNG·Filed 2011·Granted Nov 19, 2013·0 cites·20 claims
- 3434US2012199981A1Semiconductor device and method of fabricating the semiconductor deviceJEONG SE-YOUNG·Filed 2012·Application pending·0 cites
- 3533US2012234497A1Debonder to manufacture semiconductor and debonding method thereofHAN IL YOUNG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →