Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method

Abstract

A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.

What is claimed is: 
     
         1 . An apparatus to attach a semiconductor chip, the apparatus comprising:
 a flux-dotting unit to sequentially dotting a flux on a first preliminary bump and a second preliminary bump of a package substrate; and   a chip-attaching unit arranged adjacent to the flux-dotting unit to sequentially attach preliminary bumps of first and second semiconductor chips to the first and second preliminary bumps of the package substrate.   
     
     
         2 . The apparatus of  claim 1 , wherein the flux-dotting unit comprises:
 a dotting head configured to store the flux; and   a nozzle installed at the head, the nozzle having nozzle holes to dot the flux on the first and second preliminary bumps of the package substrate.   
     
     
         3 . The apparatus of  claim 2 , wherein the flux-dotting unit further comprises a gap-adjusting member to adjust a gap between the nozzle and the first and second preliminary bumps of the package substrate. 
     
     
         4 . The apparatus of  claim 3 , wherein the gap-adjusting member comprises:
 a rod extending from the nozzle and making contact with the package substrate; and   a spring connected between the rod and the nozzle.   
     
     
         5 . An apparatus that attaches a semiconductor chip, the apparatus comprising:
 a flux-dotting unit to deposit a first flux on at least one first substrate bump of a package substrate, and to deposit a second flux on at least one second substrate bump in response to an attachment signal; and   a chip-attaching unit that attaches at least one first chip bump of a first semiconductor chip to the at least one first substrate bump in response to a flux output signal.   
     
     
         6 . The apparatus of  claim 5 , further comprising at least one control module in electrical communication with the flux-dotting unit and the chip-attaching unit that generates the flux output signal in response to flux-dotting unit depositing the first flux, and that generates and that generates the attachment signal in response to the chip-attaching unit attaching the at least one first chip bump to the at least one first substrate bump. 
     
     
         7 . The apparatus of  claim 6 , wherein the flux-dotting unit includes a flux-dotting module that generates the flux output signal in response to depositing the first flux, and the chip-attaching module includes a chip-attaching module in electrical communication with the flux-dotting module that generates the chip attachment signal in response to attaching the at least one first chip bump to the at least one first substrate bump.