Inventor · disambiguated record
Lakshminarasimha Krishnapura
Also filed as: KRISHNAPURA LAKSHMINARASIMHA
20 granted patents·5 pending applications·432 citations·filing 1997–2022
96Inventor score
Top patents by PatentIndex Score
25 records- 0190US6461197B2Female contact pin including flexible contact portionSILICON BANDWIDTH INC·Filed 2001·Granted Oct 8, 2002·47 cites·5 claims
- 0289US8945401B2Method and apparatus for separating solid impurities from a fluidCOOK RUSSELL L·Filed 2012·Granted Feb 3, 2015·14 cites·10 claims
- 0383US9656188B2Method and apparatus for separating solid impurities from a fluidPARKSON CORP·Filed 2014·Granted May 23, 2017·5 cites·18 claims
- 0480US6050850AElectrical connector having staggered hold-down tabsPANDA PROJECT·Filed 1997·Granted Apr 18, 2000·30 cites·33 claims
- 0579US6305987B1Integrated connector and semiconductor die packageSILICON BANDWIDTH INC·Filed 1999·Granted Oct 23, 2001·32 cites·29 claims
- 0678US6016256AMulti-chip module having interconnect diesPANDA PROJECT·Filed 1997·Granted Jan 18, 2000·44 cites·31 claims
- 0777US6334794B1Electrical connector having staggered hold-down tabsSILICON BANDWIDTH INC·Filed 1999·Granted Jan 1, 2002·26 cites·18 claims
- 0876US6421254B2Multi-chip module having interconnect diesSILICON BANDWIDTH INC·Filed 2001·Granted Jul 16, 2002·19 cites·20 claims
- 0975US6307258B1Open-cavity semiconductor die packageSILICON BANDWIDTH INC·Filed 1998·Granted Oct 23, 2001·38 cites·24 claims
- 1073US6031720ACooling system for semiconductor die carrierPANDA PROJECT·Filed 1997·Granted Feb 29, 2000·47 cites·17 claims
- 1171US5951665AInterface optimized computer system architecturePANDA PROJECT·Filed 1997·Granted Sep 14, 1999·34 cites·37 claims
- 1271US2022259113A1Biological solids processingSCHWING BIOSET INC·Filed 2022·Application pending·0 cites
- 1367US6078102ASemiconductor die package for mounting in horizontal and upright configurationsSILICON BANDWIDTH INC·Filed 1998·Granted Jun 20, 2000·34 cites·35 claims
- 1464US11358907B2Biological solids processingSCHWING BIOSET INC·Filed 2017·Granted Jun 14, 2022·0 cites·24 claims
- 1564US6857173B1Apparatus for and method of manufacturing a semiconductor die carrierSILICON BANDWIDTH INC·Filed 2000·Granted Feb 22, 2005·9 cites·28 claims
- 1663US6266246B1Multi-chip module having interconnect diesSILICON BANDWIDTH INC·Filed 2000·Granted Jul 24, 2001·9 cites·12 claims
- 1762US6679733B2Electrical connector having electrically conductive shieldingSILICON BANDWIDTH INC·Filed 2001·Granted Jan 20, 2004·9 cites·20 claims
- 1860US6247972B1Electrical connector assembly with a female electrical connector having internal flexible contact armSILICON BANDWIDTH INC·Filed 1997·Granted Jun 19, 2001·17 cites·26 claims
- 1959US2017319987A1Method and apparatus for separating solid impurities from a fluidPARKSON CORP·Filed 2017·Application pending·0 cites
- 2055US6475832B2Open-cavity semiconductor die packageSILICON BANDWIDTH INC·Filed 2001·Granted Nov 5, 2002·5 cites·13 claims
- 2149US6709891B2Open-cavity semiconductor die packageSILICON BANDWIDTH INC·Filed 2002·Granted Mar 23, 2004·5 cites·11 claims
- 2241US6141869AApparatus for and method of manufacturing a semiconductor die carrierSILICON BANDWIDTH INC·Filed 1998·Granted Nov 7, 2000·8 cites·29 claims
- 2339US2004203281A1Electrical connector having staggered hold-down tabsPANDA PROJECT INC·Filed 2004·Application pending·0 cites
- 2438US2002176238A1Multi-chip module having interconnect diesPANDA PROJECT INC·Filed 2002·Application pending·0 cites
- 2537US2002019174A1Integrated connector and semiconductor die packageSILICON BANDWIDTH INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →