Inventor · disambiguated record
Michael G. Chafin
Also filed as: CHAFIN MICHAEL G
15 granted patents·3 pending applications·810 citations·filing 1995–2019
94Inventor score
Top patents by PatentIndex Score
18 records- 0198US6095084AHigh density plasma process chamberAPPLIED MATERIALS INC·Filed 1997·Granted Aug 1, 2000·250 cites·86 claims
- 0297US5903428AHybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating sameAPPLIED MATERIALS INC·Filed 1997·Granted May 11, 1999·300 cites·19 claims
- 0394US8270141B2Electrostatic chuck with reduced arcingWILLWERTH MICHAEL D·Filed 2010·Granted Sep 18, 2012·26 cites·20 claims
- 0492US10840062B2Radio frequency filter system for a processing chamberAPPLIED MATERIALS INC·Filed 2019·Granted Nov 17, 2020·9 cites·20 claims
- 0589US7813103B2Time-based wafer de-chucking from an electrostatic chuck having separate RF BIAS and DC chucking electrodesAPPLIED MATERIALS INC·Filed 2007·Granted Oct 12, 2010·14 cites·20 claims
- 0685US6151203AConnectors for an electrostatic chuck and combination thereofAPPLIED MATERIALS INC·Filed 1998·Granted Nov 21, 2000·76 cites·20 claims
- 0785US5636098ABarrier seal for electrostatic chuckAPPLIED MATERIALS INC·Filed 1995·Granted Jun 3, 1997·85 cites·36 claims
- 0878US6824748B2Heated catalytic treatment of an effluent gas from a substrate fabrication processAPPLIED MATERIALS INC·Filed 2001·Granted Nov 30, 2004·18 cites·23 claims
- 0977US11447868B2Method for controlling a plasma processAPPLIED MATERIALS INC·Filed 2017·Granted Sep 20, 2022·2 cites·8 claims
- 1071US10546731B1Method, apparatus and system for wafer dechucking using dynamic voltage sweepingAPPLIED MATERIALS INC·Filed 2018·Granted Jan 28, 2020·1 cites·20 claims
- 1166US7838430B2Plasma control using dual cathode frequency mixingAPPLIED MATERIALS INC·Filed 2004·Granted Nov 23, 2010·8 cites·27 claims
- 1264US9601301B2Non-intrusive measurement of a wafer DC self-bias in semiconductor processing equipmentAPPLIED MATERIALS INC·Filed 2014·Granted Mar 21, 2017·1 cites·20 claims
- 1357US6273958B2Substrate support for plasma processingAPPLIED MATERIALS INC·Filed 1999·Granted Aug 14, 2001·20 cites·26 claims
- 1451US2014034241A1Temperature enhanced electrostatic chucking in plasma processing apparatusBELOSTOTSKIY SERGY G·Filed 2013·Application pending·0 cites
- 1550US2007000611A1Plasma control using dual cathode frequency mixingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1644US8580693B2Temperature enhanced electrostatic chucking in plasma processing apparatusBELOSTOTSKIY SERGEY G·Filed 2011·Granted Nov 12, 2013·0 cites·19 claims
- 1739US9070536B2Plasma reactor electrostatic chuck with cooled process ring and heated workpiece support surfaceAPPLIED MATERIALS INC·Filed 2012·Granted Jun 30, 2015·0 cites·18 claims
- 1837US2003010292A1Electrostatic chuck with dielectric coatingAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →