Assignee
YU WAN-LING
5 granted patents·2 pending applications·42 citations·filing 2007–2012
Top patents by PatentIndex Score
7 records- 0184US7713861B2Method of forming metallic bump and seal for semiconductor deviceYU WAN-LING·Filed 2008·Granted May 11, 2010·18 cites·21 claims
- 0281US7713860B2Method of forming metallic bump on I/O padYU WAN-LING·Filed 2007·Granted May 11, 2010·14 cites·10 claims
- 0371US7968446B2Metallic bump structure without under bump metallurgy and manufacturing method thereofYU WAN-LING·Filed 2008·Granted Jun 28, 2011·5 cites·28 claims
- 0464US7733627B2Structure of embedded capacitorYU WAN-LING·Filed 2007·Granted Jun 8, 2010·3 cites·7 claims
- 0561US8723313B2Semiconductor package structure and method for manufacturing the sameYU WAN-LING·Filed 2012·Granted May 13, 2014·2 cites·6 claims
- 0643US2011086505A1Metallic bump structure without under bump metallurgy and a manufacturing method thereofYU WAN-LING·Filed 2010·Application pending·0 cites
- 0743US2010320560A1Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method ThereofYU WAN-LING·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →