Assignee
HONG JI-HO
KR·1 granted patent·22 pending applications·0 citations·filing 2006–2009
Top patents by PatentIndex Score
23 records- 0145US2009212334A1Semiconductor device and a method for manufacturing the sameHONG JI HO·Filed 2009·Application pending·0 cites
- 0240US8097505B2Method of forming isolation layer in semiconductor deviceHONG JI-HO·Filed 2008·Granted Jan 17, 2012·0 cites·10 claims
- 0340US2009160060A1Method of manufacturing semiconductor deviceHONG JI-HO·Filed 2008·Application pending·0 cites
- 0439US2009098670A1Semiconductor device for monitoring current characteristic and monitoring method for current characteristic of semiconductor deviceHONG JI-HO·Filed 2008·Application pending·0 cites
- 0539US2009305481A1Method for manufacturing semiconductor memory deviceHONG JI HO·Filed 2009·Application pending·0 cites
- 0638US2008160655A1Method of verifying line reliability and method of manufacturing semiconductor deviceHONG JI HO·Filed 2007·Application pending·0 cites
- 0738US2008157164A1Flash Memory and Method for Fabricating ThereofHONG JI HO·Filed 2007·Application pending·0 cites
- 0837US2008054315A1Method for manufacturing semiconductor device by using two step pocket implant processHONG JI-HO·Filed 2007·Application pending·0 cites
- 0937US2008048272A1Silicidation monitoring pattern for use in semiconductor manufacturing processHONG JI-HO·Filed 2007·Application pending·0 cites
- 1037US2008050917A1Method of manufacturing semiconductor deviceHONG JI-HO·Filed 2007·Application pending·0 cites
- 1137US2008160672A1Method for manufacturing semiconductor deviceHONG JI-HO·Filed 2007·Application pending·0 cites
- 1237US2009261477A1Semiconductor device and method of manufacturing the sameHONG JI-HO·Filed 2007·Application pending·0 cites
- 1336US2007134509A1Copper interconnection structure and method for forming sameHONG JI HO·Filed 2006·Application pending·0 cites
- 1436US2008079098A1Semiconductor Device and Fabricating Method ThereofHONG JI HO·Filed 2007·Application pending·0 cites
- 1536US2008048324A1Fabricating Semiconductor DeviceHONG JI HO·Filed 2007·Application pending·0 cites
- 1636US2008124554A1Semiconductor device and method for manufacturing the sameHONG JI-HO·Filed 2007·Application pending·0 cites
- 1736US2008124916A1Method of Manufacturing Semiconductor DeviceHONG JI HO·Filed 2007·Application pending·0 cites
- 1836US2008122092A1Semiconductor Device and Method of Manufacturing the SameHONG JI HO·Filed 2007·Application pending·0 cites
- 1936US2007151860A1Method for forming a copper metal interconnection of a semiconductor deviceHONG JI HO·Filed 2006·Application pending·0 cites
- 2035US2008012063A1Flash Memory and Method for Manufacturing the SameHONG JI HO·Filed 2007·Application pending·0 cites
- 2135US2008160692A1Method for Manufacturing Flash Memory DeviceHONG JI HO·Filed 2007·Application pending·0 cites
- 2235US2009152615A1Semiconductor device and method for manufacturing the sameHONG JI-HO·Filed 2008·Application pending·0 cites
- 2334US2008157234A1Semiconductor device and method of manufacturing the sameHONG JI HO·Filed 2007·Application pending·0 cites
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