Assignee
HU YONGQI
0 granted patents·3 pending applications·0 citations·filing 2007–2010
Top patents by PatentIndex Score
3 records- 0168US2009036032A1Temperature control for ecmp processHU YONGQI·Filed 2008·Application pending·0 cites
- 0251US2008108288A1Conductive Polishing Article for Electrochemical Mechanical PolishingHU YONGQI·Filed 2007·Application pending·0 cites
- 0342US2011105000A1Chemical Mechanical Planarization Pad With Surface CharacteristicsHU YONGQI·Filed 2010·Application pending·0 cites
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