Temperature control for ecmp process

Abstract

Methods for polishing a substrate are provided. In one embodiment, the method includes pressing a substrate against a pad assembly disposed on rotating platen assembly, the pad assembly comprising an electrode coupled to a power source, flowing an electrolyte fluid onto the pad assembly, wherein the electrolyte fluid is in contact with the substrate and the electrode, creating an electrical bias between the electrode and the substrate, and heating the electrolyte fluid with an infrared lamp to a temperature of at least 10 degrees Celsius above room temperature.

1 . A method for polishing a substrate, comprising:
 rotating a platen assembly, the platen assembly having a pad assembly disposed thereon, the pad assembly comprising an electrode and an abrasive pad;   creating an electrical bias between the electrode and the pad;   heating or cooling the pad assembly or an electrolyte fluid;   supplying the electrolyte fluid to the pad assembly;   rotating the substrate; and   lowering the substrate into contact with the pad assembly.   
     
     
         2 . The method of  claim 1 , wherein an infrared lamp is disposed in the platen assembly and the act of heating or cooling comprises operating the lamp to heat the pad assembly. 
     
     
         3 . The method of  claim 1 , wherein the platen assembly rotates relative to a base, an infrared lamp is attached to the base, and the act of heating or cooling comprises operating the lamp to heat the pad assembly or the electrolyte fluid. 
     
     
         4 . The method of  claim 1 , wherein an inductive coil is disposed between the electrode and the platen assembly and the act of heating or cooling comprises operating the coil to heat the pad assembly. 
     
     
         5 . The method of  claim 1 , wherein a fluid channel is formed in an upper surface of the platen assembly and the act of heating or cooling comprises circulating a heated or cooled thermal fluid through the fluid channel. 
     
     
         6 . The method of  claim 1 , wherein the act of heating or cooling comprises heating or cooling the electrolyte fluid. 
     
     
         7 . The method of  claim 1 , wherein the act of heating or cooling comprises heating the pad assembly or the electrolyte fluid to a temperature of at least 10 degrees Celsius above room temperature. 
     
     
         8 . A method for polishing a substrate, comprising:
 pressing a substrate against a pad assembly disposed on rotating platen assembly, the pad assembly comprising an electrode coupled to a power source;   flowing an electrolyte fluid onto the pad assembly, wherein the electrolyte fluid is in contact with the substrate and the electrode;   creating an electrical bias between the electrode and the substrate; and   heating the electrolyte fluid with an infrared lamp to a temperature of at least 10 degrees Celsius above room temperature.   
     
     
         9 . A method for polishing a substrate, comprising:
 pressing a substrate against a pad assembly disposed on rotating platen assembly, the pad assembly comprising an electrode coupled to a power source;   thermally regulating an electrolyte fluid in a heat exchanger;   flowing the thermally regulated electrolyte fluid onto the pad assembly, wherein the electrolyte fluid is in contact with the substrate and the electrode;   creating an electrical bias between the electrode and the substrate, wherein a conductive path is established through the thermally regulated electrolyte fluid between the electrode and the substrate; and   removing material from the substrate in the presence of the electrical bias and thermally regulated electrolyte fluid.   
     
     
         10 . The method of  claim 9 , wherein thermally regulating the electrolyte fluid further comprises:
 maintaining the electrolyte fluid at a temperature of at least 10 degrees Celsius above room temperature.   
     
     
         11 . The method of  claim 10 , wherein maintaining the temperature of the electrolyte fluid further comprises:
 heating the electrolyte fluid with an infrared lamp.   
     
     
         12 . The method of  claim 10 , wherein maintaining the temperature of the electrolyte fluid further comprises:
 operating a coil to heat the pad assembly.   
     
     
         13 . The method of  claim 10 , wherein maintaining the temperature of the electrolyte fluid further comprises:
 circulating a heated or cooled thermal fluid through a fluid channel formed in the platen assembly.