USD1026838SActiveUtility

Heat dissipation module

35
Assignee: TAIWAN MICROLOOPS CORPPriority: Apr 26, 2022Filed: Apr 26, 2022Granted: May 14, 2024
Est. expiryApr 26, 2042(~15.7 yrs left)· nominal 20-yr term from priority
Inventors:Chun-Hung Lin
35
PatentIndex Score
0
Cited by
20
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a heat dissipation module, as shown and described.

Join the waitlist — get patent alerts

Track USD1026838S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.