Assignee
TAIWAN MICROLOOPS CORP
TW·23 granted patents·44 pending applications·65 citations·filing 2005–2025
Top patents by PatentIndex Score
67 records- 0198US10048015B1Liquid-vapor separating type heat conductive structureTAIWAN MICROLOOPS CORP·Filed 2017·Granted Aug 14, 2018·15 cites·7 claims
- 0297US11304331B1Heat dissipating module having auxiliary fanTAIWAN MICROLOOPS CORP·Filed 2020·Granted Apr 12, 2022·6 cites·6 claims
- 0397US11060799B1Vapor chamber structureTAIWAN MICROLOOPS CORP·Filed 2020·Granted Jul 13, 2021·5 cites·6 claims
- 0496US12535278B2Heat dissipation device of heat pipe combined with vapor chamberTAIWAN MICROLOOPS CORP·Filed 2024·Granted Jan 27, 2026·2 cites·10 claims
- 0593US12374316B2Separate active noise cancellation deviceTAIWAN MICROLOOPS CORP·Filed 2023·Granted Jul 29, 2025·2 cites·8 claims
- 0693US10018427B2Vapor chamber structureTAIWAN MICROLOOPS CORP·Filed 2016·Granted Jul 10, 2018·9 cites·10 claims
- 0791US10012445B2Vapor chamber and heat pipe combined structureTAIWAN MICROLOOPS CORP·Filed 2016·Granted Jul 3, 2018·8 cites·7 claims
- 0888US10483190B2Thermal conduction structrure and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2017·Granted Nov 19, 2019·6 cites·7 claims
- 0982US9841246B2Dual material vapor chamber and upper shell thereofTAIWAN MICROLOOPS CORP·Filed 2016·Granted Dec 12, 2017·2 cites·2 claims
- 1079US10927842B2Cooling fan moduleTAIWAN MICROLOOPS CORP·Filed 2018·Granted Feb 23, 2021·4 cites·6 claims
- 1176US11044833B2Water-cooled pressurized distributive heat dissipation system for rackTAIWAN MICROLOOPS CORP·Filed 2019·Granted Jun 22, 2021·2 cites·10 claims
- 1276US10288356B2Vapor chamber and heat pipe combined structure and combining method thereofTAIWAN MICROLOOPS CORP·Filed 2016·Granted May 14, 2019·2 cites·9 claims
- 1375US10999952B1Vapor chamber and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2020·Granted May 4, 2021·1 cites·3 claims
- 1474US12276461B2Vapor chamber and single-piece support structure thereofTAIWAN MICROLOOPS CORP·Filed 2023·Granted Apr 15, 2025·0 cites·10 claims
- 1573US12436723B2Display card with noise reduction mechanismTAIWAN MICROLOOPS CORP·Filed 2023·Granted Oct 7, 2025·0 cites·11 claims
- 1669US12173969B2Separate capillary vapor chamber structure for dual heat sourcesTAIWAN MICROLOOPS CORP·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
- 1767US11044832B2Water-cooled distributive heat dissipation system for rackTAIWAN MICROLOOPS CORP·Filed 2019·Granted Jun 22, 2021·1 cites·5 claims
- 1867US2026055969A1Three-dimensional vapor chamber bonding structureTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 1966US2025290702A1Vapor chamber with sandwiched upper wickTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 2066US2025290703A1Heat dissipation structure combining vapor chamber with heat pipe and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 2166US2025297810A1Vapor chamber structure with partially increased plate thicknessTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 2265US12114464B2Liquid immersion coolerTAIWAN MICROLOOPS CORP·Filed 2022·Granted Oct 8, 2024·0 cites·8 claims
- 2364US12490409B2Vapor chamber and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2022·Granted Dec 2, 2025·0 cites·2 claims
- 2464US2026049771A1Three-dimensional vapor chamber assembly structureTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 2563US12010814B2Liquid immersion cooling sheet with improved surface structureTAIWAN MICROLOOPS CORP·Filed 2022·Granted Jun 11, 2024·0 cites·3 claims
- 2663US11892240B2Combination structure of vapor chamber and heat pipeTAIWAN MICROLOOPS CORP·Filed 2022·Granted Feb 6, 2024·0 cites·8 claims
- 2763US2025334346A1Three-dimensional vapor chamber cooling deviceTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 2862US11125507B2Heat dissipating apparatus using phase change heat transferTAIWAN MICROLOOPS CORP·Filed 2019·Granted Sep 21, 2021·0 cites·9 claims
- 2962US2024216833A1Vapor chamber degassing tube structure and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2023·Application pending·0 cites
- 3059US2023356113A1Vapor chamber with improved fixing structure for degassing tubeTAIWAN MICROLOOPS CORP·Filed 2022·Application pending·0 cites
- 3158US2024060724A1Vapor chamber and supporting column securement structure thereofTAIWAN MICROLOOPS CORP·Filed 2023·Application pending·0 cites
- 3256US2024329704A1Heat dissipation device having noise cancelling moduleTAIWAN MICROLOOPS CORP·Filed 2023·Application pending·0 cites
- 3356US2023122387A1Vapor chamber with unequal cross-sectional widthsTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 3456US2023123190A1Vapor chamber with spoiler structureTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 3555US2025223969A1Membrane fanTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 3655US2026049772A1Three-dimensional vapor chamber assembly structureTAIWAN MICROLOOPS CORP·Filed 2025·Application pending·0 cites
- 3754US2024268081A1Composite heat dissipation deviceTAIWAN MICROLOOPS CORP·Filed 2023·Application pending·0 cites
- 3854US2023324130A1Heat dissipation module and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2022·Application pending·0 cites
- 3954US2023337398A1Heat dissipation moduleTAIWAN MICROLOOPS CORP·Filed 2022·Application pending·0 cites
- 4054US2022364798A1Heat dissipation module and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 4153US2023354552A1Assembly structure of vapor chamber and heat pipeTAIWAN MICROLOOPS CORP·Filed 2022·Application pending·0 cites
- 4251US2020033067A1Heat sink and cooling device using the sameTAIWAN MICROLOOPS CORP·Filed 2018·Application pending·0 cites
- 4350US2022346274A1Heat dissipation structure and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 4450US2023012170A1Heat conduction structure with liquid-gas split mechanismTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 4549US2022243991A1Wind-guiding type heat dissipation moduleTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 4648US2022272873A1Water-cooled and flow-controlled heat dissipation system used in cabinet and control method thereofTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 4747US2021307206A1Vapor chamber structureTAIWAN MICROLOOPS CORP·Filed 2020·Application pending·0 cites
- 4847US2021215434A1Thin type vapor chamber and method for making the sameTAIWAN MICROLOOPS CORP·Filed 2020·Application pending·0 cites
- 4946US2008040925A1Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating sameTAIWAN MICROLOOPS CORP·Filed 2007·Application pending·0 cites
- 5045US2017314873A1Heat conduction module structure and method of manufacturing the sameTAIWAN MICROLOOPS CORP·Filed 2016·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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