US6896710B2ExpiredUtilityA1

Abrasives for CMP applications

Assignee: J G SYSTEMS INCPriority: Sep 1, 2003Filed: Oct 3, 2003Granted: May 24, 2005
Est. expirySep 1, 2023(expired)· nominal 20-yr term from priority
Inventors:John Grunwald
H10P 52/403B24B 7/228C09G 1/02B24D 11/00B24D 3/06C09K 3/1445
65
PatentIndex Score
9
Cited by
11
References
4
Claims

Abstract

The present invention provides a novel, structurally improved, abrasive agent, with improved surface properties resulting, inter alia, in enhanced wettability, dispersability and bonding. More specifically, the present invention provides according to an aspect thereof, an abrasive agent comprising abrasive particles, said particles being in the form of a composite material comprising more than one metal oxide material. In another aspect, the present invention provides an abrasive agent comprising metal oxide abrasive particles, said particles being coated at least partially with an extraneous metal or metal bearing layer.

Claims

exact text as granted — not AI-modified
1. A chemical mechanical polishing composition comprising metal oxide abrasive particles, said particles being coated at least partially with an extraneous metal layer, wherein the metal layer comprises a metal in its zero valence state, and wherein the metal layer also comprises a material selected from the group consisting of metal oxides, metal hydroxides, water-insoluble metal compounds, and mixtures of the foregoing. 
     
     
       2. The composition of  claim 1  wherein the metal layer comprises at least one metal selected from the group consisting of Cu, Ti, Fe, Sn, Pb, Ta, Mo, and Nb. 
     
     
       3. The composition of  claim 1  wherein the metal layer comprises copper in its zero valence state. 
     
     
       4. The composition according to  claim 1  wherein the composition also comprises abrasive particles which are not coated with a metal layer.

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