Assignee
J G SYSTEMS INC
US·10 granted patents·2 pending applications·121 citations·filing 1997–2013
Top patents by PatentIndex Score
12 records- 0194US6875097B2Fixed abrasive CMP pad with built-in additivesJ G SYSTEMS INC·Filed 2003·Granted Apr 5, 2005·52 cites·12 claims
- 0280US5895581ALaser imaging of printed circuit patterns without using phototoolsJ G SYSTEMS INC·Filed 1997·Granted Apr 20, 1999·48 cites·19 claims
- 0365US6896710B2Abrasives for CMP applicationsJ G SYSTEMS INC·Filed 2003·Granted May 24, 2005·9 cites·4 claims
- 0462US7148147B2CMP composition containing organic nitro compoundsJ G SYSTEMS INC·Filed 2005·Granted Dec 12, 2006·1 cites·6 claims
- 0562US6599563B2Method and apparatus for improving interfacial chemical reactions in electroless depositions of metalsJ G SYSTEMS INC·Filed 2002·Granted Jul 29, 2003·4 cites·12 claims
- 0659US6524490B1Method for electroless copper deposition using a hypophosphite reducing agentJ G SYSTEMS INC·Filed 2000·Granted Feb 25, 2003·3 cites·16 claims
- 0754US2013344235A1Autocatalytic electroless copper using hypophosphite reducerJ G SYSTEMS INC·Filed 2013·Application pending·0 cites
- 0850US7247557B2Method and composition to minimize dishingJ G SYSTEMS INC·Filed 2004·Granted Jul 24, 2007·2 cites·13 claims
- 0947US6998066B2CMP composition containing organic nitro compoundsJ G SYSTEMS INC·Filed 2003·Granted Feb 14, 2006·1 cites·2 claims
- 1047US6955586B2CMP composition and processJ G SYSTEMS INC·Filed 2003·Granted Oct 18, 2005·1 cites·3 claims
- 1142US2010215840A1METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR SnJ G SYSTEMS INC·Filed 2010·Application pending·0 cites
- 1240US6805911B2Method and apparatus for improving interfacial chemical reactionsJ G SYSTEMS INC·Filed 2003·Granted Oct 19, 2004·0 cites·4 claims
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