Component Carrier With Cavity and Laser Protection Structure

Abstract

A component carrier with a stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure, a cavity formed in the stack and delimited by a bottom wall and a sidewall, and an electrically conductive laser protection structure at least in an edge region between the bottom wall and the sidewall.

1 . A component carrier, comprising:
 a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure;   a cavity formed in the stack and delimited by a bottom wall and a sidewall; and   an electrically conductive laser protection structure at least in an edge region between the bottom wall and the sidewall.   
     
     
         2 . The component carrier according to  claim 1 ,
 Wherein the electrically conductive laser stop structure covers at least part of said bottom wall and/or of said sidewall and at least partially covered by said laser protection structure, wherein the laser stop structure forms part of the at least one electrically conductive layer structure of the stack.   
     
     
         3 . The component carrier according to  claim 2 ,
 wherein the laser stop structure and the laser protection structure form a multilayer conductive structure,   wherein a first portion of the multilayer conductive structure is exposed in the cavity and a second portion of the multilayer conductive structure is embedded in the stack,   wherein the laser protection structure is arranged in the second portion.   
     
     
         4 . The component carrier according to  claim 2 ,
 wherein the laser protection structure is arranged to disable a direct physical contact between an upper main surface and/or a sidewall of the laser stop structure and the rest of the stack.   
     
     
         5 . The component carrier according to  claim 3 ,
 wherein the laser protection structure forms at least part of the first portion and/or of the second portion.   
     
     
         6 . The component carrier according to  claim 1 ,
 wherein an area of the electrically conductive laser protection structure is larger than an area of the bottom wall of the cavity in the stack.   
     
     
         7 . The component carrier according to  claim 1 ,
 wherein the electrically conductive laser protection structure extends laterally beyond the bottom wall of the cavity in the stack.   
     
     
         8 . The component carrier according to  claim 1 ,
 wherein the sidewall has an undercut between the stack and the electrically conductive laser protection structure.   
     
     
         9 . The component carrier according to  claim 1 , further comprising at least one of the following features:
 wherein the cavity has a depth of at least 500 μm;   wherein the cavity has a depth of at least 50% of a thickness of the stack.   
     
     
         10 . The component carrier according to  claim 1 ,
 wherein the laser protection structure is made of a material configured for reflecting laser light.   
     
     
         11 . The component carrier according to  claim 1 ,
 wherein the laser protection structure is made of a material having a higher reflectivity of laser light than copper.   
     
     
         12 . The component carrier according to  claim 1 ,
 wherein the laser protection structure comprises silver and/or aluminum.   
     
     
         13 . The component carrier according to  claim 2 ,
 wherein the laser stop structure comprises copper.   
     
     
         14 . The component carrier according to  claim 1 ,
 wherein the laser protection structure and/or the laser stop structure forms an annularly closed frame extending entirely along said edge region.   
     
     
         15 . The component carrier according to  claim 1 ,
 wherein the laser protection structure and/or the laser stop structure is non-functional in terms of an electric and/or an optical functionality of the component carrier.   
     
     
         16 . The component carrier according to  claim 2 ,
 wherein the laser stop structure forms an electrically conductive pattern covering a part of said bottom wall and exposing another part of said bottom wall,   wherein the laser protection structure covers only the upper main surface of the electrically conductive pattern in the edge region, and optionally covers only sidewalls of the electrically conductive pattern in the edge region; and/or   wherein the electrically conductive pattern is formed on the bottom wall and in the edge region of said cavity.   
     
     
         17 . The component carrier according to  claim 2 ,
 wherein the laser stop structure covers the entire bottom wall of the cavity,   wherein the electrically conductive laser protection structure covers the entire upper main surface of the laser stop structure and optionally covers sidewalls of the laser stop structure.   
     
     
         18 . The component carrier according to  claim 1 ,
 wherein the stack comprises a core and a layer build-up on said core, and wherein the cavity extends through the entire layer build-up and partially into said core; and/or   further comprising at least one component inserted at least partially in at least part of said cavity.   
     
     
         19 . A method of manufacturing a component carrier, comprising:
 providing a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure;   forming a cavity in the stack, said cavity being delimited by a bottom wall and a sidewall; and   forming an electrically conductive laser protection structure at least in an edge region between the bottom wall and the sidewall, said laser protection structure forming part of the readily manufactured component carrier.   
     
     
         20 . The method according to  claim 19 , further comprising at least one of the following features:
 forming the cavity by processing the stack with a laser beam during which the laser protection structure protects against the laser beam a layer structure of the stack;   arranging an electrically conductive laser stop structure on the bottom wall of the cavity;   wherein the laser protection structure is made of a material having, in relation to an operation wavelength of the laser beam, an absorption rate below 0.2 and/or a reflectivity of at least 0.7;   forming the cavity by processing with a pulsed laser beam;   forming the pulsed laser beam with laser light pulses having a temporal length and/or a temporal distance of not more than 1 ps;   forming the cavity by processing with a laser beam having a wavelength below 600 nm;   forming a poorly adhesive release structure at least partially on the laser protection structure in an interior of the stack;   separating a piece of the stack above the release structure by forming with a laser, a circumferential separation trench around said piece; and   removing said separated piece and said release structure from the rest of the stack.